{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T08:56:39Z","timestamp":1725526599952},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,4]]},"DOI":"10.1109\/coolchips.2013.6547906","type":"proceedings-article","created":{"date-parts":[[2013,7,9]],"date-time":"2013-07-09T14:58:56Z","timestamp":1373381936000},"page":"i-ii","source":"Crossref","is-referenced-by-count":0,"title":["Message from the Organizing Committee Chair"],"prefix":"10.1109","author":[{"given":"Hiroaki","family":"Kobayashi","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"2013 COOL Chips XVI","start":{"date-parts":[[2013,4,17]]},"location":"Yokohama, Japan","end":{"date-parts":[[2013,4,19]]}},"container-title":["2013 IEEE COOL Chips XVI"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6533890\/6547903\/06547906.pdf?arnumber=6547906","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T18:27:16Z","timestamp":1490207236000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6547906\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,4]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/coolchips.2013.6547906","relation":{},"subject":[],"published":{"date-parts":[[2013,4]]}}}