{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T10:45:31Z","timestamp":1725446731373},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,4]]},"DOI":"10.1109\/coolchips.2014.6842940","type":"proceedings-article","created":{"date-parts":[[2014,7,28]],"date-time":"2014-07-28T17:04:42Z","timestamp":1406567082000},"page":"iii-iii","source":"Crossref","is-referenced-by-count":0,"title":["Message from the advisory committee chair"],"prefix":"10.1109","author":[{"given":"Tadao","family":"Nakamura","sequence":"first","affiliation":[]}],"member":"263","event":{"name":"2014 IEEE COOL Chips XVII (COOL Chips)","start":{"date-parts":[[2014,4,14]]},"location":"Yokohama, Japan","end":{"date-parts":[[2014,4,16]]}},"container-title":["2014 IEEE COOL Chips XVII"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6832910\/6842936\/06842940.pdf?arnumber=6842940","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T16:40:51Z","timestamp":1490287251000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6842940\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,4]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/coolchips.2014.6842940","relation":{},"subject":[],"published":{"date-parts":[[2014,4]]}}}