{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T11:56:40Z","timestamp":1725537400332},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/coolchips.2015.7158655","type":"proceedings-article","created":{"date-parts":[[2015,7,16]],"date-time":"2015-07-16T21:56:47Z","timestamp":1437083807000},"page":"1-3","source":"Crossref","is-referenced-by-count":2,"title":["Fined-grained body biasing for frequency scaling in advanced SOI processes"],"prefix":"10.1109","author":[{"given":"Johannes Maximilian","family":"Kuhn","sequence":"first","affiliation":[]},{"given":"Hideharu","family":"Amano","sequence":"additional","affiliation":[]},{"given":"Oliver","family":"Bringmann","sequence":"additional","affiliation":[]},{"given":"Wolfgang","family":"Rosenstiel","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2007.43"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/2435264.2435280"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2015.1051"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/FPT.2013.6718395"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/1508128.1508135"},{"article-title":"A 3 ghz dual core processor arm cortextm-a9 in 28 nm utbb fd-soi cmos with ultra-wide voltage range and energy efficiency optimization","year":"2014","author":"jacquet","key":"ref1"}],"event":{"name":"2015 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XVIII)","start":{"date-parts":[[2015,4,13]]},"location":"Yokohama, Japan","end":{"date-parts":[[2015,4,15]]}},"container-title":["2015 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XVIII)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7148313\/7158521\/07158655.pdf?arnumber=7158655","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T21:11:14Z","timestamp":1490389874000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7158655\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/coolchips.2015.7158655","relation":{},"subject":[],"published":{"date-parts":[[2015,4]]}}}