{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T15:48:32Z","timestamp":1725724112689},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2017,4,1]],"date-time":"2017-04-01T00:00:00Z","timestamp":1491004800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2017,4,1]],"date-time":"2017-04-01T00:00:00Z","timestamp":1491004800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,4]]},"DOI":"10.1109\/coolchips.2017.7946378","type":"proceedings-article","created":{"date-parts":[[2017,6,15]],"date-time":"2017-06-15T22:35:41Z","timestamp":1497566141000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["Panel discussions: \u201cCool chips for the next decade\u201d"],"prefix":"10.1109","author":[{"given":"Hideharu","family":"Amano","sequence":"first","affiliation":[{"name":"Keio University, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tadao","family":"Nakamura","sequence":"additional","affiliation":[{"name":"Keio University, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroaki","family":"Kobayashi","sequence":"additional","affiliation":[{"name":"Tohoku University, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hironori","family":"Kasahara","sequence":"additional","affiliation":[{"name":"Waseda University, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yoshiaki","family":"Hagiwara","sequence":"additional","affiliation":[{"name":"AIPS, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jeffrey L.","family":"Burns","sequence":"additional","affiliation":[{"name":"IBM Research, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David","family":"Brash","sequence":"additional","affiliation":[{"name":"ARM, United Kingdom"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","start":{"date-parts":[[2017,4,19]]},"location":"Yokohama, Japan","end":{"date-parts":[[2017,4,21]]}},"container-title":["2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7939939\/7946365\/07946378.pdf?arnumber=7946378","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,27]],"date-time":"2024-02-27T19:05:03Z","timestamp":1709060703000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7946378\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,4]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/coolchips.2017.7946378","relation":{},"subject":[],"published":{"date-parts":[[2017,4]]}}}