{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T15:59:08Z","timestamp":1780675148590,"version":"3.54.1"},"reference-count":23,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,12,5]],"date-time":"2021-12-05T00:00:00Z","timestamp":1638662400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,12,5]],"date-time":"2021-12-05T00:00:00Z","timestamp":1638662400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,12,5]],"date-time":"2021-12-05T00:00:00Z","timestamp":1638662400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,12,5]]},"DOI":"10.1109\/dac18074.2021.9586325","type":"proceedings-article","created":{"date-parts":[[2021,11,8]],"date-time":"2021-11-08T23:30:34Z","timestamp":1636414234000},"page":"187-192","source":"Crossref","is-referenced-by-count":4,"title":["NeurFill: Migrating Full-Chip CMP Simulators to Neural Networks for Model-Based Dummy Filling Synthesis"],"prefix":"10.1109","author":[{"given":"Junzhe","family":"Cai","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Changhao","family":"Yan","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuzhe","family":"Ma","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bei","family":"Yu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dian","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xuan","family":"Zeng","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2638452"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2966994"},{"key":"ref12","first-page":"603","article-title":"A novel and unified full-chip CMP model aware dummy fill insertion framework with SQP-based optimization method","volume":"40","author":"cai","year":"2021","journal-title":"IEEE TCAD"},{"key":"ref13","first-page":"902","article-title":"Model-based dummy feature placement for oxide chemical-mechanical polishing manufacturability","volume":"20","author":"tian","year":"2001","journal-title":"IEEE TCAD"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2007.357783"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415704"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1149\/1.3133238"},{"key":"ref17","author":"cai","year":"2007","journal-title":"Modeling of pattern dependencies in the fabrication of multilevel copper metallization"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/0022-3093(90)90200-6"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1017\/S0962492900002518"},{"key":"ref4","first-page":"3","article-title":"Performance-aware CMP fill pattern optimization","author":"kahng","year":"2007","journal-title":"Proc VMIC"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317826"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD45719.2019.8942079"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045668"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001377"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/43.752928"},{"key":"ref2","first-page":"402","article-title":"Efficient approximation algorithms for chemical mechanical polishing dummy fill","volume":"30","author":"feng","year":"2011","journal-title":"IEEE TCAD"},{"key":"ref1","first-page":"373","article-title":"Investigation of the capacitance deviation due to metal-fills and the effective interconnect geometry modeling","author":"lee","year":"2003","journal-title":"Proc ISQED"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2015.75"},{"key":"ref20","first-page":"234","article-title":"U-Net: Convolutional networks for biomedical image segmentation","author":"ronneberger","year":"2015","journal-title":"Proc MICCAI"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/CEC.2014.6900309"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218611"},{"key":"ref23","year":"0","journal-title":"CMP predictor"}],"event":{"name":"2021 58th ACM\/IEEE Design Automation Conference (DAC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2021,12,5]]},"end":{"date-parts":[[2021,12,9]]}},"container-title":["2021 58th ACM\/IEEE Design Automation Conference (DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9585997\/9586083\/09586325.pdf?arnumber=9586325","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T16:55:50Z","timestamp":1652201750000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9586325\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,12,5]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/dac18074.2021.9586325","relation":{},"subject":[],"published":{"date-parts":[[2021,12,5]]}}}