{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,10]],"date-time":"2026-09-10T23:07:09Z","timestamp":1789081629353,"version":"build-2803163510"},"reference-count":25,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,7,9]],"date-time":"2023-07-09T00:00:00Z","timestamp":1688860800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,7,9]],"date-time":"2023-07-09T00:00:00Z","timestamp":1688860800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,7,9]]},"DOI":"10.1109\/dac56929.2023.10247666","type":"proceedings-article","created":{"date-parts":[[2023,9,15]],"date-time":"2023-09-15T13:31:31Z","timestamp":1694784691000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps"],"prefix":"10.1109","author":[{"given":"Lingjun","family":"Zhu","sequence":"first","affiliation":[{"name":"Georgia Institute of Technology,School of Electrical and Computer Engineering"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sung Kyu","family":"Lim","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology,School of Electrical and Computer Engineering"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653703"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586229"},{"key":"ref15","article-title":"Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3D ICs","author":"vanna-iampikul","year":"2022","journal-title":"Trans Comput -Aided Des Integr Circuits Syst"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2387827"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/3473462"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/3372780.3375567"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3850\/9783981537079_0541"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2014.6831837"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116297"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218582"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3073070"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415720"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898043"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2897589"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2681064"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116293"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3181185"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/3531437.3539702"},{"key":"ref8","first-page":"488","author":"franzon","year":"2019","journal-title":"Handbook of 3D Integration Volume 4 Design Test and Thermal Management"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2013.6724579"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492421"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/2872334.2872361"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2712665"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062957"},{"key":"ref5","article-title":"Advanced Sensor Sys-˜ tems by Low-Temperature Heterogeneous 3D Integration Processes","author":"fernandez-bolanos","year":"2018","journal-title":"DTIP MEMS MOEMS - Symp Des Test Integr Packag"}],"event":{"name":"2023 60th ACM\/IEEE Design Automation Conference (DAC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,7,9]]},"end":{"date-parts":[[2023,7,13]]}},"container-title":["2023 60th ACM\/IEEE Design Automation Conference (DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10247654\/10247655\/10247666.pdf?arnumber=10247666","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,10,2]],"date-time":"2023-10-02T13:41:26Z","timestamp":1696254086000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10247666\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,7,9]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/dac56929.2023.10247666","relation":{},"subject":[],"published":{"date-parts":[[2023,7,9]]}}}