{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:43:33Z","timestamp":1740102213231,"version":"3.37.3"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,7,9]],"date-time":"2023-07-09T00:00:00Z","timestamp":1688860800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,7,9]],"date-time":"2023-07-09T00:00:00Z","timestamp":1688860800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,7,9]]},"DOI":"10.1109\/dac56929.2023.10247770","type":"proceedings-article","created":{"date-parts":[[2023,9,15]],"date-time":"2023-09-15T17:31:31Z","timestamp":1694799091000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["FPDsim: A Structural Simulator For Power Grid Analysis Of Flat Panel Display"],"prefix":"10.1109","author":[{"given":"Chengtao","family":"An","sequence":"first","affiliation":[{"name":"Fudan University,School of Mathematical Sciences,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chunqiao","family":"Li","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems,Microelectronics Department,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiangqi","family":"Li","sequence":"additional","affiliation":[{"name":"Empyrean Technology Co. Ltd,Beijing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yangfeng","family":"Su","sequence":"additional","affiliation":[{"name":"Fudan University,School of Mathematical Sciences,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fan","family":"Yang","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems,Microelectronics Department,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuan","family":"Zeng","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems,Microelectronics Department,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/j.2168-0159.2013.tb06189.x"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2021.3132693"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/sdtp.12622"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/3450626.3459851"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/1391989.1391995"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2282418"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.2968543"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3060647"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3529533"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1137\/1.9780898719505"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1002\/nla.2356"}],"event":{"name":"2023 60th ACM\/IEEE Design Automation Conference (DAC)","start":{"date-parts":[[2023,7,9]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2023,7,13]]}},"container-title":["2023 60th ACM\/IEEE Design Automation Conference (DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10247654\/10247655\/10247770.pdf?arnumber=10247770","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T03:29:20Z","timestamp":1705030160000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10247770\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,7,9]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/dac56929.2023.10247770","relation":{},"subject":[],"published":{"date-parts":[[2023,7,9]]}}}