{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,21]],"date-time":"2026-02-21T20:27:33Z","timestamp":1771705653095,"version":"3.50.1"},"reference-count":47,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,6,22]],"date-time":"2025-06-22T00:00:00Z","timestamp":1750550400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,6,22]],"date-time":"2025-06-22T00:00:00Z","timestamp":1750550400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000028","name":"Semiconductor Research Corporation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000028","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,6,22]]},"DOI":"10.1109\/dac63849.2025.11132483","type":"proceedings-article","created":{"date-parts":[[2025,9,15]],"date-time":"2025-09-15T17:35:41Z","timestamp":1757957741000},"page":"1-7","source":"Crossref","is-referenced-by-count":1,"title":["YAP: Yield Modeling and Simulation for Advanced Packaging"],"prefix":"10.1109","author":[{"given":"Zhichao","family":"Chen","sequence":"first","affiliation":[{"name":"University of California,Department of Electrical and Computer Engineering,Los Angeles"}]},{"given":"Puneet","family":"Gupta","sequence":"additional","affiliation":[{"name":"University of California,Department of Electrical and Computer Engineering,Los Angeles"}]}],"member":"263","reference":[{"key":"ref1","first-page":"34","volume-title":"Others Enabling hybrid bonding on Intel process. 2021 IEEE International Electron Devices Meeting (IEDM).","author":"Elsherbini"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51529.2024.00056"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2023.3265529"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00175"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.23919\/ICEP55381.2022.9795476"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VTS60656.2024.10538776"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/VLSID.2014.12"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165052"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490688"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247947"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51529.2024.00058"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS48203.2023.10118173"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1117\/1.JMM.12.3.033014"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1117\/12.968368"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC60143.2024.10712136"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51529.2024.00069"},{"key":"ref17","volume-title":"Process Development and Process Window Investigation of Copper-Silicon Dioxide Die-to-Wafer (D2W) Hybrid Bonding","author":"Ren","year":"2021"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC50525.2020.9315002"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1063\/1.369377"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC60143.2024.10712062"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC47984.2019.9026578"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2020.3035652"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/icept59018.2023.10492426"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijsolstr.2016.02.041"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1149\/11203.0003ecst"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.3390\/mi15111332"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC60143.2024.10712080"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32862.2020.00046"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2017.8268486"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51909.2023.00027"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2024.160103"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ectc51529.2024.00131"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1163\/156856196X00832"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1149\/1.2357071"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1016\/S0065-2156(08)70164-9"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1149\/2162-8777\/acbe18"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.3390\/mi13040537"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1149\/2162-8777\/ac7662"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/66.97808"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1147\/rd.284.0461"},{"key":"ref41","article-title":"Characterization of defects in integrated circuits: resources, models and applications","author":"Bruls","year":"1992"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.3390\/ma17092150"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/5.705525"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32696.2021.00078"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51909.2023.00138"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51909.2023.00283"},{"key":"ref47","volume-title":"Hybrid Bonding Process Flow - Advanced Packaging Part 5","author":"Patel","year":"2024"}],"event":{"name":"2025 62nd ACM\/IEEE Design Automation Conference (DAC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2025,6,22]]},"end":{"date-parts":[[2025,6,25]]}},"container-title":["2025 62nd ACM\/IEEE Design Automation Conference (DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11132383\/11132091\/11132483.pdf?arnumber=11132483","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,16]],"date-time":"2025-09-16T05:58:54Z","timestamp":1758002334000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11132483\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,6,22]]},"references-count":47,"URL":"https:\/\/doi.org\/10.1109\/dac63849.2025.11132483","relation":{},"subject":[],"published":{"date-parts":[[2025,6,22]]}}}