{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,23]],"date-time":"2025-05-23T04:46:44Z","timestamp":1747975604060},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,4]]},"DOI":"10.1109\/date.2009.5090740","type":"proceedings-article","created":{"date-parts":[[2013,2,19]],"date-time":"2013-02-19T13:16:39Z","timestamp":1361279799000},"page":"610-615","source":"Crossref","is-referenced-by-count":3,"title":["Co-design of signal, power, and thermal distribution networks for 3D ICs"],"prefix":"10.1109","author":[{"family":"Young-Joon Lee","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yoon Jo Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Gang Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Bakir","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.","family":"Joshi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Fedorov","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Sung Kyu Lim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"year":"0","key":"13"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1145\/1123008.1123042"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1982.1585498"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2007.4397267"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2008.4546911"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2007.4405766"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2007.4405764"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2006.243964"},{"journal-title":"Numerical Heat Transfer and Fluid Flow","year":"1980","author":"patankar","key":"7"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1115\/1.1839582"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2005.862693"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2008.4672173"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/TCS.1975.1084079"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2007.4387161"}],"event":{"name":"2009 Design, Automation & Test in Europe Conference & Exhibition (DATE'09)","start":{"date-parts":[[2009,4,20]]},"location":"Nice","end":{"date-parts":[[2009,4,24]]}},"container-title":["2009 Design, Automation & Test in Europe Conference & Exhibition"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4926138\/5090609\/05090740.pdf?arnumber=5090740","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T00:24:26Z","timestamp":1489796666000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5090740\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,4]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/date.2009.5090740","relation":{},"subject":[],"published":{"date-parts":[[2009,4]]}}}