{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,30]],"date-time":"2025-04-30T23:00:05Z","timestamp":1746054005318,"version":"3.28.0"},"reference-count":20,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,3]]},"DOI":"10.1109\/date.2010.5457230","type":"proceedings-article","created":{"date-parts":[[2013,2,19]],"date-time":"2013-02-19T18:16:33Z","timestamp":1361297793000},"page":"99-104","source":"Crossref","is-referenced-by-count":27,"title":["An efficient distributed memory interface for many-core platform with 3D stacked DRAM"],"prefix":"10.1109","author":[{"given":"Igor","family":"Loi","sequence":"first","affiliation":[]},{"given":"Luca","family":"Benini","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"130","article-title":"8gb 3d ddr3 dram using through-silicon-via technology","volume":"12","year":"2009","journal-title":"2009 IEEE International Solid-State Circuits Conference"},{"article-title":"Tezzaron semincoductor","year":"2006","author":"patti","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.134"},{"key":"ref13","first-page":"991","article-title":"A thermally-aware performance analysis of vertically integrated (3-d) processor-memory hierarchy","author":"loi","year":"2006","journal-title":"Proceedings of the 43rd Annual Design Automation Conference"},{"key":"ref14","article-title":"Picoserver: using 3d stacking technology to enable a compact energy efficient chip multiprocessor","volume":"41","author":"taeho","year":"2006","journal-title":"Proceedings of the 2006 ASPLOS Conference"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2008.15"},{"year":"2009","key":"ref16","article-title":"Databahn ™dram memory controller ip"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1555754.1555810"},{"year":"2009","key":"ref18","article-title":"Imis ™- intimate memory interface specification"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.4108\/ICST.NANONET2007.2033"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1147\/rd.504.0491"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.873612"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/378239.379048"},{"key":"ref5","first-page":"469","article-title":"Die stacking (3d) micro architecture","year":"0","journal-title":"39th International Symposium on Microarchitecture December 2006"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/378239.379048"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/2.976921"},{"year":"2009","key":"ref2","article-title":"Ddr sdram system-power calculator"},{"year":"2005","key":"ref1","article-title":"Ddr sdram point-to-point simulation process"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/2.976921"},{"key":"ref20","first-page":"387","article-title":"Development of fine pitch solder microbumps for 3d chip stacking","author":"aibin","year":"2008","journal-title":"Electronics Packaging Technology Conference"}],"event":{"name":"2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)","start":{"date-parts":[[2010,3,8]]},"location":"Dresden","end":{"date-parts":[[2010,3,12]]}},"container-title":["2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5450668\/5456897\/05457230.pdf?arnumber=5457230","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T20:11:51Z","timestamp":1489867911000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5457230\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,3]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/date.2010.5457230","relation":{},"subject":[],"published":{"date-parts":[[2010,3]]}}}