{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,3]],"date-time":"2025-11-03T13:30:50Z","timestamp":1762176650584},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,3]]},"DOI":"10.1109\/date.2011.5763069","type":"proceedings-article","created":{"date-parts":[[2013,2,19]],"date-time":"2013-02-19T22:45:16Z","timestamp":1361313916000},"page":"1-6","source":"Crossref","is-referenced-by-count":6,"title":["Analytical heat transfer model for thermal through-silicon vias"],"prefix":"10.1109","author":[{"family":"Hu Xu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"V F","family":"Pavlidis","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G","family":"De Micheli","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"2011 Design, Automation & Test in Europe","start":{"date-parts":[[2011,3,14]]},"location":"Grenoble","end":{"date-parts":[[2011,3,18]]}},"container-title":["2011 Design, Automation & Test in Europe"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5754459\/5762992\/05763069.pdf?arnumber=5763069","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T11:13:31Z","timestamp":1490094811000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5763069\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,3]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/date.2011.5763069","relation":{},"subject":[],"published":{"date-parts":[[2011,3]]}}}