{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T19:27:47Z","timestamp":1725564467966},"reference-count":25,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,3]]},"DOI":"10.1109\/date.2011.5763176","type":"proceedings-article","created":{"date-parts":[[2013,2,19]],"date-time":"2013-02-19T17:45:16Z","timestamp":1361295916000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Case study: Alleviating hotspots and improving chip reliability via carbon nanotube thermal interface"],"prefix":"10.1109","author":[{"family":"Wei Zhang","sequence":"first","affiliation":[]},{"family":"Jiale Huang","sequence":"additional","affiliation":[]},{"family":"Shengqi Yang","sequence":"additional","affiliation":[]},{"given":"P","family":"Gupta","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"OpenSparc Tl","year":"0","key":"ref10"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"journal-title":"Single-Walled CNT","year":"0","key":"ref12"},{"journal-title":"Multi-Walled CNT","year":"0","key":"ref13"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.41.4370"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/APCCAS.2006.342144"},{"key":"ref16","first-page":"189","article-title":"Differentiating the roles of IR measurement and simulation for power and temperature-aware design","author":"bhardwaj","year":"0","journal-title":"Proc Custom Integrated Circuits Conf"},{"key":"ref17","first-page":"583","article-title":"Leakage power dependent temperature estimation to predict thermal runaway in FinFET circuits","author":"choi","year":"0","journal-title":"Proc Int Conf Computer-Aided Design"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1115\/1.2352778"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/20\/48\/485203"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/19\/21\/215706"},{"key":"ref3","first-page":"249","article-title":"Carbon nanotube inter-connects: Implications for performance, power dissipation and thermal management","author":"srivastava","year":"0","journal-title":"Proc Int Electronic Device Mtg"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.89.075505"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/416495a"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.870069"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2008.4479851"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2007.892079"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681639"},{"journal-title":"International Technology Roadmap for Semiconductors","year":"0","key":"ref1"},{"journal-title":"Commercial silicone grease thermal conductivity","year":"0","key":"ref20"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2005.07.058"},{"key":"ref21","first-page":"421","article-title":"Assembling of carbon nanotube structures by chemical anchoring for packaging applications","author":"lin","year":"0","journal-title":"Proc Elec Comp & Tech Conf"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/1450135.1450181"},{"key":"ref23","first-page":"364","article-title":"The impact of NBTI on the performance of combinational and sequential circuits","author":"wang","year":"0","journal-title":"Proc Design Automation Conf"},{"key":"ref25","first-page":"1508","article-title":"H.264 HDTV decoder using application-specific networks-on-chip","author":"xu","year":"0","journal-title":"Proc Int Conf Multimedia Expo"}],"event":{"name":"2011 Design, Automation & Test in Europe","start":{"date-parts":[[2011,3,14]]},"location":"Grenoble","end":{"date-parts":[[2011,3,18]]}},"container-title":["2011 Design, Automation & Test in Europe"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5754459\/5762992\/05763176.pdf?arnumber=5763176","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T04:53:26Z","timestamp":1490072006000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5763176\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,3]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/date.2011.5763176","relation":{},"subject":[],"published":{"date-parts":[[2011,3]]}}}