{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T06:26:01Z","timestamp":1725776761108},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,11]]},"DOI":"10.1109\/dcis201949030.2019.8959904","type":"proceedings-article","created":{"date-parts":[[2020,1,17]],"date-time":"2020-01-17T02:11:20Z","timestamp":1579227080000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["On the Use of Built-In Temperature Sensors to Monitor Aging in RF Circuits"],"prefix":"10.1109","author":[{"given":"Anant","family":"Rungta","sequence":"first","affiliation":[]},{"given":"Josep","family":"Altet","sequence":"additional","affiliation":[]},{"given":"Enrique","family":"Barajas","sequence":"additional","affiliation":[]},{"given":"Antonio","family":"Rubio","sequence":"additional","affiliation":[]},{"given":"Xavier","family":"Aragones","sequence":"additional","affiliation":[]},{"given":"Diego","family":"Mateo","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1109\/ESSCIRC.2011.6044952"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/ICMEL.1995.500864"},{"year":"2013","author":"altet","journal-title":"Thermal Testing of Integrated Circuits","key":"ref12"},{"year":"1992","author":"thomas","journal-title":"Heat Transfer","key":"ref13"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1016\/j.mee.2017.05.021"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/TED.2007.896601"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1088\/0957-0233\/19\/11\/115704"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/TEST.2012.6401589"},{"year":"2017","author":"alejandro","journal-title":"Design of a CMOS power amplifier and built-in sensors for variability monitoring and compensation","key":"ref8"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/TCSI.2010.2072372"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/JSSC.2012.2185549"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1007\/978-1-4614-6163-0"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1016\/j.sna.2017.06.022"}],"event":{"name":"2019 XXXIV Conference on Design of Circuits and Integrated Systems (DCIS)","start":{"date-parts":[[2019,11,20]]},"location":"Bilbao, Spain","end":{"date-parts":[[2019,11,22]]}},"container-title":["2019 XXXIV Conference on Design of Circuits and Integrated Systems (DCIS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8952591\/8959817\/08959904.pdf?arnumber=8959904","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,15]],"date-time":"2022-07-15T03:13:14Z","timestamp":1657854794000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8959904\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,11]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/dcis201949030.2019.8959904","relation":{},"subject":[],"published":{"date-parts":[[2019,11]]}}}