{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,14]],"date-time":"2025-10-14T11:37:24Z","timestamp":1760441844952,"version":"3.32.0"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,11,13]],"date-time":"2024-11-13T00:00:00Z","timestamp":1731456000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,13]],"date-time":"2024-11-13T00:00:00Z","timestamp":1731456000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,11,13]]},"DOI":"10.1109\/dcis62603.2024.10769179","type":"proceedings-article","created":{"date-parts":[[2024,12,3]],"date-time":"2024-12-03T18:54:06Z","timestamp":1733252046000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["A novel experiment approach to ohmic contact formation on p-doped SiC"],"prefix":"10.1109","author":[{"given":"Roberto","family":"Vabres","sequence":"first","affiliation":[{"name":"University of Palermo Viale delle scienze ed. 8,Palermo"}]},{"given":"Gabriele","family":"Bellocchi","sequence":"additional","affiliation":[{"name":"St Microelectronics Strada Primosole 50,Catania"}]},{"given":"Simone","family":"Rascun\u00e0","sequence":"additional","affiliation":[{"name":"St Microelectronics Strada Primosole 50,Catania"}]},{"given":"Fabrizio","family":"Roccaforte","sequence":"additional","affiliation":[{"name":"IMM CNR Strada VIII Zona Industriale 5,Catania"}]},{"given":"Paola","family":"Mancuso","sequence":"additional","affiliation":[{"name":"St Microelectronics Strada Primosole 50,Catania"}]},{"given":"Paolo","family":"Badal\u00e0","sequence":"additional","affiliation":[{"name":"St Microelectronics Strada Primosole 50,Catania"}]},{"given":"Valeria","family":"Puglisi","sequence":"additional","affiliation":[{"name":"St Microelectronics Strada Primosole 50,Catania"}]},{"given":"Marilena","family":"Vivona","sequence":"additional","affiliation":[{"name":"IMM CNR Strada VIII Zona Industriale 5,Catania"}]},{"given":"Isodiana","family":"Crupi","sequence":"additional","affiliation":[{"name":"University of Palermo Viale delle scienze ed. 8,Palermo"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.7567\/jjap.54.040103"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/tie.2017.2652401"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-08726-9_2"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tpel.2013.2268900"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2017.11.021"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.solener.2016.11.041"},{"key":"ref7","article-title":"Effects of Rapid Thermal Annealing on Ar Inductively Coupled Plasma-Treated","author":"Tsui","year":"2018","journal-title":"IEEE TRANSACTIONS ON ELECTRON DEVICES"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/wipdaasia.2019.8760317"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1021\/acsaelm.2c00748"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.4028\/p-6z36aj"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1063\/1.4987136"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/S0038-1101(00)00056-3"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcrysgro.2019.125353"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1038\/ncomms13562"},{"article-title":"Formation of Ti ohmic contact on p-SiC by laser annealing","volume-title":"International Conference on Silicon Carbide and Related Materials (ICSCRM)","author":"Bellocchi","key":"ref15"}],"event":{"name":"2024 39th Conference on Design of Circuits and Integrated Systems (DCIS)","start":{"date-parts":[[2024,11,13]]},"location":"Catania, Italy","end":{"date-parts":[[2024,11,15]]}},"container-title":["2024 39th Conference on Design of Circuits and Integrated Systems (DCIS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10769040\/10769041\/10769179.pdf?arnumber=10769179","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,10]],"date-time":"2025-01-10T19:56:04Z","timestamp":1736538964000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10769179\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11,13]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/dcis62603.2024.10769179","relation":{},"subject":[],"published":{"date-parts":[[2024,11,13]]}}}