{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T01:58:23Z","timestamp":1725415103563},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,4]]},"DOI":"10.1109\/ddecs.2011.5783056","type":"proceedings-article","created":{"date-parts":[[2011,6,7]],"date-time":"2011-06-07T17:09:21Z","timestamp":1307466561000},"page":"99-104","source":"Crossref","is-referenced-by-count":5,"title":["Wireless wafer-level testing of integrated circuits via capacitively-coupled channels"],"prefix":"10.1109","author":[{"given":"Dae Young","family":"Lee","sequence":"first","affiliation":[]},{"given":"David D.","family":"Wentzloff","sequence":"additional","affiliation":[]},{"given":"John P.","family":"Hayes","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.914762"},{"key":"ref11","first-page":"358","article-title":"A 0.14 pJ\/b Inductive-Coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping","author":"miura","year":"0","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref12","first-page":"298","article-title":"An 11Gb\/s Inductive-Coupling Link with Burst Transmission","author":"miura","year":"0","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.845560"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2005.1584004"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IEMBS.2009.5333163"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/EDL.1982.25610"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/0167-9260(84)90016-6"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2006.885073"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5434018"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MCMC.1994.292520"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2009.96"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751456"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2009.5090751"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/5.867687"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1387391"},{"journal-title":"International Technology Roadmap for Semiconductors","year":"2009","key":"ref1"},{"key":"ref9","first-page":"448","article-title":"Two 10Gb\/s\/pin Low-Power Interconnect Methods for 3D ICs","author":"gu","year":"0","journal-title":"ISSCC Dig Tech Papers"}],"event":{"name":"Systems (DDECS)","start":{"date-parts":[[2011,4,13]]},"location":"Cottbus, Germany","end":{"date-parts":[[2011,4,15]]}},"container-title":["14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5771301\/5783023\/05783056.pdf?arnumber=5783056","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T09:08:34Z","timestamp":1490087314000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5783056\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,4]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/ddecs.2011.5783056","relation":{},"subject":[],"published":{"date-parts":[[2011,4]]}}}