{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T11:17:56Z","timestamp":1725448676254},"reference-count":37,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,4]]},"DOI":"10.1109\/ddecs.2012.6219030","type":"proceedings-article","created":{"date-parts":[[2012,6,22]],"date-time":"2012-06-22T23:29:31Z","timestamp":1340407771000},"page":"83-88","source":"Crossref","is-referenced-by-count":4,"title":["A simulation framework for 3-dimension Networks-on-chip with different vertical channel density configurations"],"prefix":"10.1109","author":[{"given":"Haoyuan","family":"Ying","sequence":"first","affiliation":[]},{"given":"Ashok","family":"Jaiswal","sequence":"additional","affiliation":[]},{"given":"Mohamed A","family":"Abd El Ghany","sequence":"additional","affiliation":[]},{"given":"Thomas","family":"Hollstein","sequence":"additional","affiliation":[]},{"given":"Klaus","family":"Hofmann","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"19","DOI":"10.1109\/3DIC.2009.5306585"},{"doi-asserted-by":"publisher","key":"35","DOI":"10.1109\/HSC.1998.666245"},{"doi-asserted-by":"publisher","key":"17","DOI":"10.1109\/ICDSP.2009.5201090"},{"key":"36","article-title":"Smff: System models for free","author":"neukirchner","year":"2011","journal-title":"2nd International Workshop on Analysis Tools and Methodologies for Embedded and Real-Time Systems"},{"key":"18","article-title":"Architecture and design effcient 3d network-on-chip (3d noc) for custom multicore soc","author":"ben ahmed","year":"2010","journal-title":"OCG International Conference on Broadband and Wireless Computing"},{"key":"33","article-title":"A performance comparison between hardened-by-design and conventional-design standard cells","author":"lunardini","year":"2004","journal-title":"Proc Radiation Effects on Components and Systems Workshop"},{"doi-asserted-by":"publisher","key":"15","DOI":"10.1109\/ASPDAC.2010.5419830"},{"year":"2010","author":"samman","journal-title":"Microarchitecture and Implementation of Networks-on-Chip with a Flexible Concept for Communication Media Sharing","key":"34"},{"doi-asserted-by":"publisher","key":"16","DOI":"10.1109\/NORCHP.2009.5397851"},{"key":"13","first-page":"1081","article-title":"3-D Topologies for networks-on-chip","author":"pavdilis","year":"2007","journal-title":"IEEE Transactions on Very Large Scale Integration System"},{"doi-asserted-by":"publisher","key":"14","DOI":"10.1109\/DATE.2009.5090625"},{"doi-asserted-by":"publisher","key":"37","DOI":"10.1109\/TED.2005.856795"},{"year":"0","journal-title":"International Technology Roadmap for Semiconductors (ITRS","key":"11"},{"key":"12","article-title":"Tsv redanduncy: Architecture and design issues in 3d ic","author":"hsieh","year":"2010","journal-title":"Design Automation and Test in Europe Conference and Exhibition"},{"doi-asserted-by":"publisher","key":"21","DOI":"10.1109\/TCAD.2010.2065990"},{"doi-asserted-by":"publisher","key":"20","DOI":"10.1109\/TCSII.2010.2047320"},{"doi-asserted-by":"publisher","key":"22","DOI":"10.1109\/VDAT.2010.5496709"},{"key":"23","article-title":"Fast design space exploration environment applied on noc's for 3d-stacked mpsoc's","author":"richard","year":"2010","journal-title":"International Conference on Architecture of Computing Systems (ARCS"},{"doi-asserted-by":"publisher","key":"24","DOI":"10.1109\/DATE.2005.11"},{"doi-asserted-by":"publisher","key":"25","DOI":"10.1109\/ICIEA.2009.5138241"},{"doi-asserted-by":"publisher","key":"26","DOI":"10.1109\/NANONET.2006.346216"},{"doi-asserted-by":"publisher","key":"27","DOI":"10.1109\/MDT.2010.116"},{"doi-asserted-by":"publisher","key":"28","DOI":"10.1109\/DSD.2009.192"},{"key":"29","article-title":"User-centric design space exploration for heterogeneous network-on-chip platforms","author":"chou","year":"2009","journal-title":"Design Automation & Test in Europe Conference & Exhibition (DATE"},{"doi-asserted-by":"publisher","key":"3","DOI":"10.1109\/IITC.2006.1648629"},{"key":"2","article-title":"Network-on-chip interconnection for future gigascale mcsocs applications: Communication and computation orthogonalization","author":"ben abdallah","year":"2006","journal-title":"Tunisia-Japan Symposium on Society"},{"doi-asserted-by":"publisher","key":"10","DOI":"10.1109\/ASPDAC.2009.4796516"},{"doi-asserted-by":"publisher","key":"1","DOI":"10.1109\/2.976921"},{"key":"30","first-page":"24","article-title":"The SPLASH-2 programs: characterization and methodological considerations","author":"woo","year":"1995","journal-title":"Proceedings 22nd Annual International Symposium on Computer Architecture ISCA"},{"year":"2009","author":"motoyoshi","journal-title":"Through-Silicon Via (TSV","key":"7"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1109\/NORCHIP.2010.5669453"},{"doi-asserted-by":"publisher","key":"32","DOI":"10.1109\/ICPADS.2010.56"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1109\/ICM.2010.5696135"},{"year":"2011","author":"bienia","journal-title":"Benchmarking Modern Multiprocessors","key":"31"},{"year":"2008","author":"philip","journal-title":"Handbook of 3D Integration Technology and Applications of 3D Integrated Circuits","key":"4"},{"year":"0","key":"9"},{"year":"0","key":"8"}],"event":{"name":"2012 IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)","start":{"date-parts":[[2012,4,18]]},"location":"Tallinn, Estonia","end":{"date-parts":[[2012,4,20]]}},"container-title":["2012 IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6213418\/6219000\/06219030.pdf?arnumber=6219030","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T15:01:09Z","timestamp":1490108469000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6219030\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,4]]},"references-count":37,"URL":"https:\/\/doi.org\/10.1109\/ddecs.2012.6219030","relation":{},"subject":[],"published":{"date-parts":[[2012,4]]}}}