{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,20]],"date-time":"2025-12-20T22:25:54Z","timestamp":1766269554326},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,4]]},"DOI":"10.1109\/ddecs50862.2020.9095744","type":"proceedings-article","created":{"date-parts":[[2020,5,19]],"date-time":"2020-05-19T21:07:10Z","timestamp":1589922430000},"page":"1-6","source":"Crossref","is-referenced-by-count":6,"title":["Efficient Patch Module for Single-bank or Dual-bank Firmware Updates for Embedded Devices"],"prefix":"10.1109","author":[{"given":"Ondrej","family":"Kachman","sequence":"first","affiliation":[]},{"given":"Marcel","family":"Balaz","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/DDECS.2018.00-11"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ET.2018.8549667"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.comcom.2019.03.014"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCSP.2016.7754349"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/INFCOM.2013.6566786"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/NVMSA.2016.7547182"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ET.2018.8549628"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.5220\/0007383400300039"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1155\/2018\/2940952"},{"article-title":"Dual-bank and single-bank updates","year":"0","author":"semiconductor","key":"ref1"}],"event":{"name":"2020 23rd International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)","start":{"date-parts":[[2020,4,22]]},"location":"Novi Sad, Serbia","end":{"date-parts":[[2020,4,24]]}},"container-title":["2020 23rd International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9093721\/9095556\/09095744.pdf?arnumber=9095744","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,27]],"date-time":"2022-06-27T16:06:52Z","timestamp":1656346012000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9095744\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,4]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/ddecs50862.2020.9095744","relation":{},"subject":[],"published":{"date-parts":[[2020,4]]}}}