{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T23:47:11Z","timestamp":1725407231982},"reference-count":14,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/dftvs.2002.1173497","type":"proceedings-article","created":{"date-parts":[[2003,6,26]],"date-time":"2003-06-26T01:03:42Z","timestamp":1056589422000},"page":"12-19","source":"Crossref","is-referenced-by-count":1,"title":["Effect of static power dissipation in burn-in environment on yield of VLSI"],"prefix":"10.1109","author":[{"given":"A.","family":"Vassighi","sequence":"first","affiliation":[]},{"given":"O.","family":"Semenov","sequence":"additional","affiliation":[]},{"given":"M.","family":"Sachdev","sequence":"additional","affiliation":[]},{"given":"A.","family":"Keshavarzi","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/6.625244"},{"year":"0","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/16.55751"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/16.43668"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TEPM.2000.895059"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/92.748196"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"252","DOI":"10.1145\/313817.313937","article-title":"Technology scaling behavior of optimum reverse body bias for standby leakage power reduction in CMOS IC's","author":"keshavarzi","year":"1999","journal-title":"Proceedings 1999 International Symposium on Low Power Electronics and Design (Cat No 99TH8477) LPE"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICM.2000.916403"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/16.556151"},{"key":"ref8","first-page":"88","article-title":"Thermal Components Models for Electro-Thermal Network Simulation","author":"blackburn","year":"1993","journal-title":"Proc 9th IEEE SEMI-THERM Symposium"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/S0038-1101(00)00120-9"},{"key":"ref2","article-title":"Thermal Challenges During Microprocessor Testing","author":"tadayon","year":"2000","journal-title":"Intel Tech Journal Q3"},{"key":"ref1","first-page":"167","article-title":"Burn-In","author":"vollertsen","year":"1999","journal-title":"IEEE International Integrated Reliability Workshop Final Report"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/16.974706"}],"event":{"name":"17th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems. DFT 2002","acronym":"DFTVS-02","location":"Vancouver, BC, Canada"},"container-title":["17th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, 2002. DFT 2002. Proceedings."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8374\/26363\/01173497.pdf?arnumber=1173497","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,15]],"date-time":"2017-06-15T22:46:01Z","timestamp":1497566761000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1173497\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/dftvs.2002.1173497","relation":{},"subject":[]}}