{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T11:56:28Z","timestamp":1725796588041},"reference-count":5,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/dftvs.2003.1250090","type":"proceedings-article","created":{"date-parts":[[2004,3,1]],"date-time":"2004-03-01T21:26:50Z","timestamp":1078176410000},"page":"11-17","source":"Crossref","is-referenced-by-count":9,"title":["Reliability estimation model of IC's interconnect based on uniform distribution of defects on a chip"],"prefix":"10.1109","author":[{"family":"Tianxu Zhao","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Xuchao Duan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/66.382275"},{"key":"ref3","first-page":"108","article-title":"Breakdown Energy of Metal (BEM)-A New Technique for Monitoring Metallization Reliability at Waferlevel","author":"hong","year":"1985","journal-title":"IEEE\/IRPS(International Reliability Physics Symposium)"},{"article-title":"Study of IC Local Defect and Its Related IC Functional Yield and IC Interconnects Electromigration","year":"1998","author":"jiang","key":"ref5"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/55.260787"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/16.278507"}],"event":{"name":"18th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","acronym":"DFTVS-03","location":"Boston, MA, USA"},"container-title":["Proceedings. 16th IEEE Symposium on Computer Arithmetic"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8839\/27973\/01250090.pdf?arnumber=1250090","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,13]],"date-time":"2017-03-13T14:27:16Z","timestamp":1489415236000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1250090\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/dftvs.2003.1250090","relation":{},"subject":[]}}