{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T00:29:24Z","timestamp":1725755364272},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,26]],"date-time":"2022-06-26T00:00:00Z","timestamp":1656201600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,26]],"date-time":"2022-06-26T00:00:00Z","timestamp":1656201600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,26]]},"DOI":"10.1109\/drc55272.2022.9855797","type":"proceedings-article","created":{"date-parts":[[2022,8,19]],"date-time":"2022-08-19T19:39:21Z","timestamp":1660937961000},"page":"1-2","source":"Crossref","is-referenced-by-count":2,"title":["Self-Heating characterization and modeling of 5nm technology node FinFETs"],"prefix":"10.1109","author":[{"given":"Shivendra S.","family":"Parihar","sequence":"first","affiliation":[{"name":"Indian Institute of Technology Kanpur,Kanpur,India,208016"}]},{"given":"Jun Z.","family":"Huang","sequence":"additional","affiliation":[{"name":"MaxLinear Inc.,Carlsbad,California,USA,92008"}]},{"given":"Weike","family":"Wang","sequence":"additional","affiliation":[{"name":"MaxLinear Inc.,Carlsbad,California,USA,92008"}]},{"given":"Kimihiko","family":"Imura","sequence":"additional","affiliation":[{"name":"MaxLinear Inc.,Carlsbad,California,USA,92008"}]},{"given":"Yogesh S.","family":"Chauhan","sequence":"additional","affiliation":[{"name":"Indian Institute of Technology Kanpur,Kanpur,India,208016"}]}],"member":"263","reference":[{"key":"ref4","first-page":"2.6.1","author":"wu","year":"2016","journal-title":"IEDM"},{"key":"ref3","first-page":"1","author":"cho","year":"2016","journal-title":"IEEE Symposium on VLSI Technology"},{"key":"ref10","first-page":"60t","author":"bury","year":"2021","journal-title":"Symposium on VLSI Technology"},{"key":"ref6","first-page":"9.2.1","author":"liu","year":"2020","journal-title":"IEDM"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2012.2205659"},{"key":"ref5","first-page":"68t","author":"ha","year":"2017","journal-title":"Symposium on VLSI Technology"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2502062"},{"journal-title":"BSIM-CMG 111 0 0 Technical Manual","year":"0","key":"ref8"},{"key":"ref7","first-page":"1","author":"choi","year":"2021","journal-title":"Symposium on VLSI Technology"},{"key":"ref2","first-page":"9.1.1","author":"wu","year":"2013","journal-title":"IEDM"},{"key":"ref9","first-page":"1","author":"scholten","year":"2009","journal-title":"IEDM"},{"key":"ref1","first-page":"3.1.1","author":"jan","year":"2012","journal-title":"IEDM"}],"event":{"name":"2022 Device Research Conference (DRC)","start":{"date-parts":[[2022,6,26]]},"location":"Columbus, OH, USA","end":{"date-parts":[[2022,6,29]]}},"container-title":["2022 Device Research Conference (DRC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9855770\/9855647\/09855797.pdf?arnumber=9855797","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,9,5]],"date-time":"2022-09-05T20:30:33Z","timestamp":1662409833000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9855797\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,26]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/drc55272.2022.9855797","relation":{},"subject":[],"published":{"date-parts":[[2022,6,26]]}}}