{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T01:17:12Z","timestamp":1774315032351,"version":"3.50.1"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,6,24]],"date-time":"2024-06-24T00:00:00Z","timestamp":1719187200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,6,24]],"date-time":"2024-06-24T00:00:00Z","timestamp":1719187200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,6,24]]},"DOI":"10.1109\/drc61706.2024.10605295","type":"proceedings-article","created":{"date-parts":[[2024,7,29]],"date-time":"2024-07-29T19:15:01Z","timestamp":1722280501000},"page":"1-2","source":"Crossref","is-referenced-by-count":1,"title":["Compact Modeling of Compound Semiconductor Memory ULTRARAM: A Universal Memory Device"],"prefix":"10.1109","author":[{"given":"Abhishek","family":"Kumar","sequence":"first","affiliation":[{"name":"Indian Institute of Technology Roorkee,Roorkee,Uttarakhand,India,247667"}]},{"given":"Avirup","family":"Dasgupta","sequence":"additional","affiliation":[{"name":"Indian Institute of Technology Roorkee,Roorkee,Uttarakhand,India,247667"}]}],"member":"263","reference":[{"issue":"7","key":"ref1","doi-asserted-by":"crossref","first-page":"529","DOI":"10.1038\/s41565-020-0655-z","volume":"15","author":"Sebastian","year":"2020","journal-title":"Nature nano-tech"},{"issue":"8","key":"ref2","first-page":"086501","volume-title":"Reports on Progress in Physics","volume":"83","author":"Schenk","year":"2020"},{"issue":"5","key":"ref3","doi-asserted-by":"crossref","first-page":"2271","DOI":"10.1109\/TED.2021.3064788","volume":"68","author":"Lane","year":"2021","journal-title":"IEEE TED"},{"issue":"4","key":"ref4","doi-asserted-by":"crossref","first-page":"2101103","DOI":"10.1002\/aelm.202101103","volume":"8","author":"Hodgson","year":"2022","journal-title":"Advanced Electronic Materials"},{"issue":"35","key":"ref5","doi-asserted-by":"crossref","DOI":"10.1088\/1361-6463\/ac0a09","volume":"54","author":"Lane","year":"2021","journal-title":"J. Physics D"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/springerreference_37557"},{"issue":"5","key":"ref7","doi-asserted-by":"crossref","first-page":"220","DOI":"10.1109\/55.491835","volume":"17","author":"Schulman","year":"1996","journal-title":"IEEE EDL"},{"key":"ref8","article-title":"ASM-HEMT 101.0. 0 Advanced SPICE Model for HEMTs","author":"Khandelwal"}],"event":{"name":"2024 Device Research Conference (DRC)","location":"College Park, MD, USA","start":{"date-parts":[[2024,6,24]]},"end":{"date-parts":[[2024,6,26]]}},"container-title":["2024 Device Research Conference (DRC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10605129\/10605242\/10605295.pdf?arnumber=10605295","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,7,30]],"date-time":"2024-07-30T05:23:29Z","timestamp":1722317009000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10605295\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,24]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/drc61706.2024.10605295","relation":{},"subject":[],"published":{"date-parts":[[2024,6,24]]}}}