{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,7]],"date-time":"2026-04-07T16:31:46Z","timestamp":1775579506574,"version":"3.50.1"},"reference-count":20,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,14]],"date-time":"2024-10-14T00:00:00Z","timestamp":1728864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,14]],"date-time":"2024-10-14T00:00:00Z","timestamp":1728864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,14]]},"DOI":"10.1109\/dttis62212.2024.10780427","type":"proceedings-article","created":{"date-parts":[[2024,12,13]],"date-time":"2024-12-13T13:49:01Z","timestamp":1734097741000},"page":"1-8","source":"Crossref","is-referenced-by-count":2,"title":["Extreme Temperature Automotive Testing"],"prefix":"10.1109","author":[{"given":"Ben","family":"Lok","sequence":"first","affiliation":[{"name":"Teradyne Incorporated,Solutions Engineering Group,San Jose,CA,United States"}]},{"given":"Si","family":"Diep","sequence":"additional","affiliation":[{"name":"Teradyne Incorporated,Solutions Engineering Group,San Jose,CA,United States"}]},{"given":"Thomas","family":"Pham","sequence":"additional","affiliation":[{"name":"Teradyne Incorporated,Solutions Engineering Group,San Jose,CA,United States"}]},{"given":"Nicholas","family":"Madrid","sequence":"additional","affiliation":[{"name":"Teradyne Incorporated,Solutions Engineering Group,San Jose,CA,United States"}]},{"given":"Mit","family":"Shah","sequence":"additional","affiliation":[{"name":"Teradyne Incorporated,Solutions Engineering Group,San Jose,CA,United States"}]},{"given":"Andrew","family":"Westall","sequence":"additional","affiliation":[{"name":"Teradyne Incorporated,Solutions Engineering Group,San Jose,CA,United States"}]},{"given":"Hamzeh","family":"Dessouki","sequence":"additional","affiliation":[{"name":"Microsoft Corporation,SMPE Group,Mountain View,CA,United States"}]},{"given":"Linh","family":"Truong","sequence":"additional","affiliation":[{"name":"Buck Switching Regulators – Wide Vin Texas Instruments Incorportated,Santa Clara,CA,United States"}]},{"given":"Andrew","family":"Davis","sequence":"additional","affiliation":[{"name":"Buck Switching Regulators – Wide Vin Texas Instruments Incorportated,Santa Clara,CA,United States"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"ETS-800 Next-generation Automotive Test Platform"},{"key":"ref2","volume-title":"ETS-364 Test System Optimized for High Volume Production Testing of Integrated Circuits"},{"key":"ref3","volume-title":"MATRiX High Parallel Tri-Temp Pick-and-Place Handler","year":"2021"},{"key":"ref4","volume-title":"SO2000 Modular Gravity Handler for Small Devices","year":"2020"},{"key":"ref5","volume-title":"Jaguar High Performance Strip Handler","year":"2020"},{"key":"ref6","volume-title":"PTC thermistors as limit temperature sensors","year":"2019"},{"key":"ref7","volume-title":"Temperature Changes: Considerations for Optimal Reed Relay Performance"},{"key":"ref8","volume-title":"General Application Guidelines","year":"2022"},{"key":"ref9","volume-title":"PhotoMOS input circuits","year":"2024"},{"key":"ref10","volume-title":"PhotoMOS CC TSON 1 Form A CxR Series Solid State Relays: Super Miniature, TSON Package","year":"2018"},{"key":"ref11","volume-title":"G3VM-MT MOS FET Relay Module","year":"2019"},{"key":"ref12","first-page":"198","volume-title":"Signal and Power Integrity Simplified","author":"Bogatin","year":"2018"},{"key":"ref13","volume-title":"High Temperature 200\u00b0C, C0G Dielectric, 10-200 VDC (Industrial Grade)","year":"2023"},{"key":"ref14","volume-title":"High Temperature 175\u00b0C, X7R Dielectric, 16-200 VDC (Industrial Grade)","year":"2023"},{"key":"ref15","volume-title":"High Power Aluminum Nitride, Wraparound Surface Mount, Precision Thin Film Chip Reistor (Up to 6W)","year":"2021"},{"key":"ref16","volume-title":"CPA Series (2512)"},{"key":"ref17","volume-title":"High Power Thin Film Chip Terminator"},{"key":"ref18","volume-title":"Thick Film Chip Resistors, Industrial, High Power, Aluminum Nitride Substrate","year":"2021"},{"key":"ref19","volume-title":"Aluminium Nitride Thin Film Power Resistor: Type 3503 Series","year":"2022"},{"key":"ref20","volume-title":"FlipChip Series Platinum Thin Film RTD for the Automatic Assembling on PCBs"}],"event":{"name":"2024 IEEE International Conference on Design, Test and Technology of Integrated Systems (DTTIS)","location":"Aix-EN-PROVENCE, France","start":{"date-parts":[[2024,10,14]]},"end":{"date-parts":[[2024,10,16]]}},"container-title":["2024 IEEE International Conference on Design, Test and Technology of Integrated Systems (DTTIS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10779589\/10779988\/10780427.pdf?arnumber=10780427","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,31]],"date-time":"2025-10-31T17:07:54Z","timestamp":1761930474000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10780427\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,14]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/dttis62212.2024.10780427","relation":{},"subject":[],"published":{"date-parts":[[2024,10,14]]}}}