{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T15:19:35Z","timestamp":1730215175647,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,6]]},"DOI":"10.1109\/ecai.2018.8678933","type":"proceedings-article","created":{"date-parts":[[2019,4,22]],"date-time":"2019-04-22T22:31:27Z","timestamp":1555972287000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["Temperature Control System for Accelerated Aging Tests on Printed Circuit Boards"],"prefix":"10.1109","author":[{"given":"Adrian Ioan","family":"LITA","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daniel Alexandru","family":"VISAN","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Laurentiu","family":"Mihai IONESCU","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alin Gheorghita","family":"MAZARE","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"189","article-title":"Influence of accelerating ageing on LTCC and PCB substrates' dielectric properties in GHz area","author":"rovensky","year":"2016","journal-title":"Proc 30th Int Spring Seminar on Electron Technol"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"279","DOI":"10.1109\/TEPM.2007.907575","article-title":"Thermal Cycling Aging Effect on the Reliability and Morphological Evolution of SnAgCu Solder Joints","volume":"30","author":"ronnie teo","year":"2007","journal-title":"IEEE Trans on Electronics Packaging Manufacturing"},{"key":"ref6","doi-asserted-by":"crossref","DOI":"10.1002\/9781119276258","author":"feinberg","year":"2016","journal-title":"Thermodynamic Degradation Science Physics of Failure Accelerated Testing Fatigue and Reliability Applications"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.23919\/EMPC.2017.8346871"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/PHM.2008.4711463"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/AUTEST.2010.5613564"}],"event":{"name":"2018 10th International Conference on Electronics, Computers and Artificial Intelligence (ECAI)","start":{"date-parts":[[2018,6,28]]},"location":"Iasi, Romania","end":{"date-parts":[[2018,6,30]]}},"container-title":["2018 10th International Conference on Electronics, Computers and Artificial Intelligence (ECAI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8672396\/8678929\/08678933.pdf?arnumber=8678933","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T02:52:00Z","timestamp":1643165520000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8678933\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,6]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/ecai.2018.8678933","relation":{},"subject":[],"published":{"date-parts":[[2018,6]]}}}