{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,1]],"date-time":"2025-11-01T19:58:33Z","timestamp":1762027113397,"version":"build-2065373602"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,6,1]],"date-time":"2020-06-01T00:00:00Z","timestamp":1590969600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,6]]},"DOI":"10.1109\/ecai50035.2020.9223120","type":"proceedings-article","created":{"date-parts":[[2020,10,16]],"date-time":"2020-10-16T20:19:48Z","timestamp":1602879588000},"page":"1-6","source":"Crossref","is-referenced-by-count":3,"title":["Optimizing the Placement of Indoor Thermal Climate Sensors of an Iot Solution"],"prefix":"10.1109","author":[{"given":"Ioana","family":"Udrea","sequence":"first","affiliation":[]},{"given":"Silviu","family":"Petrache","sequence":"additional","affiliation":[]},{"given":"Georgeta","family":"Ionascu","sequence":"additional","affiliation":[]},{"given":"Cristian Gabriel","family":"Alionte","sequence":"additional","affiliation":[]},{"given":"Viorel","family":"Ionut Gheorghe","sequence":"additional","affiliation":[]},{"given":"Tudor Catalin","family":"Apostolescu","sequence":"additional","affiliation":[]},{"given":"Laurentiu","family":"Adrian Cartal","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"Barometric Pressure\/Temperature\/Altitude Sensor","year":"0","key":"ref10"},{"journal-title":"Raspberry Pi4 desktop computer","year":"0","key":"ref11"},{"key":"ref12","article-title":"A 3D Printed Weather Station","author":"kucera","year":"2015","journal-title":"NCAR\/Research Applications Laboratory and UCAR\/JOSS"},{"journal-title":"commercial computer-aided design (CAD) and drafting software application developed by Autodesk","year":"0","key":"ref13"},{"journal-title":"Creality Slicer V1 2 2 (powered byCura) 3D printing software","year":"0","key":"ref14"},{"journal-title":"Ender 3 Pro 3D Printer developed by Creality 3D Company","year":"0","key":"ref15"},{"journal-title":"Fritzing software used to make electronic schemes","year":"0","key":"ref16"},{"journal-title":"Ansys Thermal Model Simulation Analysis Software produced by Ansys Inc","year":"0","key":"ref17"},{"journal-title":"THERM 7 7 10 Berkeley LAB two-dimensional conduction heat-transfer simulation software","year":"0","key":"ref18"},{"journal-title":"SolidWorks 2013 Solid modeling computer-aided design (CAD) and computer-aided engineering (CAE) computer program developed by Dassault Systèmes","year":"0","key":"ref19"},{"journal-title":"IoT Analytics Platform","year":"2020","key":"ref4"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1051\/e3sconf\/202018002012"},{"journal-title":"Heat management of circuit boards TEC REPORT – Issue 01","year":"0","author":"heinz","key":"ref6"},{"journal-title":"International Standard ISO 7330 Ergonomic of the thermal environment - Analytical determination and interpretation of thermal comfort using calculation of the PMV and PPD indices and local thermal comfort criteria","year":"2005","key":"ref5"},{"journal-title":"User Guide UG440 (v2019 2)","year":"2019","key":"ref8"},{"key":"ref7","article-title":"Thermal analysis of Printed Circuit Boards for airborne applications","author":"wilhelmsson","year":"2017","journal-title":"Master of Science Thesis"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2019.05.014"},{"key":"ref1","first-page":"103","article-title":"Review on-IOT Based Environment Monitoring System","volume":"8","author":"shinde","year":"2017","journal-title":"International Journal of Electronics and Communication Engineering and Technology"},{"journal-title":"DHT22 Temperature-Humidity Sensor","year":"0","key":"ref9"}],"event":{"name":"2020 12th International Conference on Electronics, Computers and Artificial Intelligence (ECAI)","start":{"date-parts":[[2020,6,25]]},"location":"Bucharest, Romania","end":{"date-parts":[[2020,6,27]]}},"container-title":["2020 12th International Conference on Electronics, Computers and Artificial Intelligence (ECAI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9218228\/9223118\/09223120.pdf?arnumber=9223120","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,27]],"date-time":"2022-06-27T15:53:11Z","timestamp":1656345191000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9223120\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,6]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/ecai50035.2020.9223120","relation":{},"subject":[],"published":{"date-parts":[[2020,6]]}}}