{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T15:29:11Z","timestamp":1730215751850,"version":"3.28.0"},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,9]]},"DOI":"10.1109\/ecoc.2018.8535339","type":"proceedings-article","created":{"date-parts":[[2018,12,7]],"date-time":"2018-12-07T22:32:30Z","timestamp":1544221950000},"page":"1-3","source":"Crossref","is-referenced-by-count":2,"title":["64Gb\/s Electro Absorption Modulator Operation in InP-Based Active-Passive Generic Integration Platform"],"prefix":"10.1109","author":[{"given":"M.","family":"Trajkovic","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.","family":"Blache","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.","family":"Jorge","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.","family":"Mekhazni","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J-G.","family":"Provost","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Debregeas","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"E.","family":"den Haan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"L. M.","family":"Augustin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K. A.","family":"Williams","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"X. J. M.","family":"Leijtens","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1364\/OFC.2009.OThT7"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2017.2717863"},{"key":"ref10","first-page":"1","article-title":"An introduction to InP-based generic integration technology","volume":"29","author":"smit","year":"2014","journal-title":"Sem Sci and Tec"},{"journal-title":"Joint European Platform for Photonics Integration of Components and Circuits","year":"0","key":"ref6"},{"journal-title":"Submicron InP DHBT Technology for High-Speed High-Swing Mixed-Signal ICs","year":"2008","author":"godin","key":"ref11"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1364\/OFC.2018.Th4A.4"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1117\/12.2017431"},{"key":"ref7","article-title":"A Novel Approach to Photonic Packaging Leveraging","volume":"22","author":"barwicz","year":"2016","journal-title":"JSTQE"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1364\/OFC.2016.Th5B.3"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2017.2720967"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1364\/OFC.2017.Th5C.2"}],"event":{"name":"2018 European Conference on Optical Communication (ECOC)","start":{"date-parts":[[2018,9,23]]},"location":"Rome","end":{"date-parts":[[2018,9,27]]}},"container-title":["2018 European Conference on Optical Communication (ECOC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8516262\/8535099\/08535339.pdf?arnumber=8535339","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,8,24]],"date-time":"2020-08-24T01:35:53Z","timestamp":1598232953000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8535339\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,9]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/ecoc.2018.8535339","relation":{},"subject":[],"published":{"date-parts":[[2018,9]]}}}