{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:17:59Z","timestamp":1740100679319,"version":"3.37.3"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,3,28]],"date-time":"2022-03-28T00:00:00Z","timestamp":1648425600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,3,28]],"date-time":"2022-03-28T00:00:00Z","timestamp":1648425600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100006180","name":"Technology Development","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100006180","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,3,28]]},"DOI":"10.1109\/educon52537.2022.9766647","type":"proceedings-article","created":{"date-parts":[[2022,5,11]],"date-time":"2022-05-11T20:32:32Z","timestamp":1652301152000},"page":"1291-1295","source":"Crossref","is-referenced-by-count":1,"title":["Formation of Skill standards for Printed Circuit Board Assembly Inspection by Define-Measure-Analyze- Improve-Control method"],"prefix":"10.1109","author":[{"given":"Wararuk","family":"Saimsakul","sequence":"first","affiliation":[{"name":"King Mongkut’s University of Technology Thonburi,Department of Electrical Technology Education,Bangkok,Thailand"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Komkrit","family":"Chomsuwan","sequence":"additional","affiliation":[{"name":"King Mongkut’s University of Technology Thonburi,Department of Electrical Technology Education,Bangkok,Thailand"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","article-title":"waste reduction during the testing production process of optical transceiver by applying the DMAIC approach","author":"thanman","year":"2010","journal-title":"Industrial Management King Mongkut’s University of Technology North Bangkok"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/ECIT50008.2020.00092"},{"key":"ref6","article-title":"The plating process of integrated circuit by applying Six sigma approach","author":"chukiat","year":"2009","journal-title":"Thammasat University"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/IEA.2019.8715225"},{"key":"ref2","first-page":"111","volume":"3","author":"prasath","year":"2013","journal-title":"Six Sigma concept and DMAIC implementation"},{"key":"ref1","article-title":"Defect reduction for optical transceivers manufacturing process by DMAIC method","author":"panoram","year":"2017","journal-title":"Industrial Engineering Thammasat University"}],"event":{"name":"2022 IEEE Global Engineering Education Conference (EDUCON)","start":{"date-parts":[[2022,3,28]]},"location":"Tunis, Tunisia","end":{"date-parts":[[2022,3,31]]}},"container-title":["2022 IEEE Global Engineering Education Conference (EDUCON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9766427\/9766377\/09766647.pdf?arnumber=9766647","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,20]],"date-time":"2022-06-20T21:16:39Z","timestamp":1655759799000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9766647\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,3,28]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/educon52537.2022.9766647","relation":{},"subject":[],"published":{"date-parts":[[2022,3,28]]}}}