{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T10:17:11Z","timestamp":1725790631428},"reference-count":24,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,5,1]],"date-time":"2019-05-01T00:00:00Z","timestamp":1556668800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,5,1]],"date-time":"2019-05-01T00:00:00Z","timestamp":1556668800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,5,1]],"date-time":"2019-05-01T00:00:00Z","timestamp":1556668800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,5]]},"DOI":"10.1109\/eit.2019.8833924","type":"proceedings-article","created":{"date-parts":[[2019,9,13]],"date-time":"2019-09-13T00:48:55Z","timestamp":1568335735000},"page":"242-248","source":"Crossref","is-referenced-by-count":2,"title":["Heat Loss Estimation using UAS Thermal Imagery"],"prefix":"10.1109","author":[{"given":"Katelyn","family":"Koiner","sequence":"first","affiliation":[]},{"given":"Andrew","family":"Rosener","sequence":"additional","affiliation":[]},{"given":"Debanjan","family":"Sadhukhan","sequence":"additional","affiliation":[]},{"given":"Daisy Flora","family":"Selvaraj","sequence":"additional","affiliation":[]},{"given":"Zakaria El","family":"Mrabet","sequence":"additional","affiliation":[]},{"given":"Matt","family":"Dunlevy","sequence":"additional","affiliation":[]},{"given":"Prakash","family":"Ranganathan","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"12131221","article-title":"Estimation of the surface thermalresistances and heat loss by conduction using thermography","author":"m marino","year":"2017","journal-title":"Appl Therm Eng 114"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1016\/j.infrared.2016.10.005"},{"key":"ref12","first-page":"187197","article-title":"Quantitative internal infrared thermography for determining in-situ thermal behavior of facades","author":"tejedor","year":"2017","journal-title":"Energy Build 151"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1016\/j.apenergy.2017.09.047"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1016\/j.enbuild.2016.11.039"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1016\/j.apenergy.2017.11.091"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.3390\/buildings8030046"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/WAC.2006.375998"},{"key":"ref18","article-title":"Finding R-values of stud frame constructed houses with IR thermography","author":"madding","year":"2008","journal-title":"Proc Inframation"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1016\/j.apenergy.2011.05.014"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1016\/j.rser.2017.10.031"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1016\/j.apenergy.2014.08.005"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1016\/j.buildenv.2016.06.011"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1016\/j.rser.2014.07.188"},{"year":"2012","journal-title":"Interim Guidelines for Thermographic Inspections of Buildings","key":"ref8"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1016\/j.enbuild.2015.01.021"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1016\/S0378-7788(01)00105-0"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1016\/j.aei.2013.03.005"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1016\/j.rser.2017.10.031"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.3390\/en6083859"},{"year":"2018","journal-title":"SENSE Batch Version 1 10 9","key":"ref22"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1016\/j.apenergy.2014.12.035"},{"key":"ref24","first-page":"211221","article-title":"Uvalue assessment by infrared thermography: a comparison of different calculation methods in a Guarded Hot Box","author":"nardi","year":"2016","journal-title":"Energy Build 122"},{"year":"2018","journal-title":"Mathematica Version 11 3","key":"ref23"}],"event":{"name":"2019 IEEE International Conference on Electro Information Technology (EIT)","start":{"date-parts":[[2019,5,20]]},"location":"Brookings, SD, USA","end":{"date-parts":[[2019,5,22]]}},"container-title":["2019 IEEE International Conference on Electro Information Technology (EIT)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8826060\/8833642\/08833924.pdf?arnumber=8833924","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,15]],"date-time":"2022-07-15T03:11:34Z","timestamp":1657854694000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8833924\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,5]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/eit.2019.8833924","relation":{},"subject":[],"published":{"date-parts":[[2019,5]]}}}