{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T16:18:13Z","timestamp":1730218693587,"version":"3.28.0"},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/embc.2015.7318485","type":"proceedings-article","created":{"date-parts":[[2015,11,5]],"date-time":"2015-11-05T17:53:44Z","timestamp":1446746024000},"page":"809-812","source":"Crossref","is-referenced-by-count":13,"title":["Non-hermetic encapsulation for implantable electronic devices based on epoxy"],"prefix":"10.1109","author":[{"given":"Fabian","family":"Boeser","sequence":"first","affiliation":[]},{"given":"Juan S.","family":"Ordonez","sequence":"additional","affiliation":[]},{"given":"Martin","family":"Schuettler","sequence":"additional","affiliation":[]},{"given":"Thomas","family":"Stieglitz","sequence":"additional","affiliation":[]},{"given":"Dennis T.T.","family":"Plachta","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1149\/1.2221147"},{"journal-title":"Techniques and engineering approaches","year":"2009","author":"greenbaum","key":"ref3"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/sc.1994.126"},{"key":"ref6","first-page":"39","article-title":"The challenges for hermetic encapsulation of implanted devices-a review","volume":"22","author":"nichols","year":"1994","journal-title":"Crit Rev Biomed Eng"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.jhep.2012.12.020"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.1976.324586"},{"key":"ref12","first-page":"333","article-title":"Packaging Hybrid Microcircuits","author":"corkhill","year":"1976","journal-title":"Handbook of Thick Film Technology"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPHP.1977.1135193"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1049\/el:19810391"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1088\/1741-2560\/10\/3\/031002"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPHP.1976.1135142"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1533\/9780857096289"}],"event":{"name":"2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)","start":{"date-parts":[[2015,8,25]]},"location":"Milan","end":{"date-parts":[[2015,8,29]]}},"container-title":["2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7302811\/7318236\/07318485.pdf?arnumber=7318485","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,9,7]],"date-time":"2018-09-07T15:36:13Z","timestamp":1536334573000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7318485\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/embc.2015.7318485","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}