{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T16:25:27Z","timestamp":1730219127926,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,12]]},"DOI":"10.1109\/emccompo.2013.6735164","type":"proceedings-article","created":{"date-parts":[[2014,2,13]],"date-time":"2014-02-13T16:07:17Z","timestamp":1392307637000},"page":"10-14","source":"Crossref","is-referenced-by-count":2,"title":["Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study"],"prefix":"10.1109","author":[{"given":"Etienne","family":"Sicard","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Wu Jian-fei","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Li Jian-cheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Models of Integrated Circuits for EMI Behavioral Simulation","year":"0","key":"13"},{"key":"14","article-title":"Modelling the emission of the DSPIC-Mem Board","author":"sicard","year":"0","journal-title":"IC-EMC Application Notes"},{"journal-title":"IEC 61967 Integrated Circuits - Measurement of Electromagnetic Emissions 150 kHz to 1 GHz","year":"0","key":"11"},{"journal-title":"IEC 62132 Integrated Circuits Measurement of Electromagnetic Immunity 150 KHz - 1 GHz","year":"0","key":"12"},{"key":"3","first-page":"20","article-title":"OSAT positioning in the emerging Mid-End: Fan Out, 3D ICS and 2.5D multi die interposers","author":"huemoeller","year":"2012","journal-title":"3D Packaging Magazine"},{"key":"2","article-title":"3D Integration: New opportunities for speed, power and performance","author":"patti","year":"2012","journal-title":"Invited Talk IMAPS"},{"key":"1","first-page":"60","article-title":"3D Stacked microprocessor: Are we there yet?","author":"loh","year":"2012","journal-title":"IEEE Micro"},{"key":"10","volume":"260","author":"sicard","year":"2011","journal-title":"A Boyer IC-EMC v2 5 User's Manual"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1002\/9781118166727"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007458"},{"journal-title":"Very Low Power CMOS SRAM 1M X 8 Bit","year":"2008","author":"sheet","key":"5"},{"journal-title":"DsPIC33FJXXXGPX06\/X08\/X10 High-Performance 16-Bit Digital Signal Controllers","year":"2009","key":"4"},{"key":"9","article-title":"Review of 3D Related Technologies for High-Energy Physics (HEP)","author":"yarema","year":"2007","journal-title":"LHC-ILC Workshop on 3D Integration Techniques"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"}],"event":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","start":{"date-parts":[[2013,12,15]]},"location":"Nara, Japan","end":{"date-parts":[[2013,12,18]]}},"container-title":["2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6729470\/6735156\/06735164.pdf?arnumber=6735164","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T19:54:17Z","timestamp":1490298857000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6735164\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,12]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/emccompo.2013.6735164","relation":{},"subject":[],"published":{"date-parts":[[2013,12]]}}}