{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T16:25:48Z","timestamp":1730219148830,"version":"3.28.0"},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,12]]},"DOI":"10.1109\/emccompo.2013.6735192","type":"proceedings-article","created":{"date-parts":[[2014,2,13]],"date-time":"2014-02-13T21:07:17Z","timestamp":1392325637000},"page":"158-162","source":"Crossref","is-referenced-by-count":0,"title":["Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling"],"prefix":"10.1109","author":[{"given":"Jonghoon J.","family":"Kim","sequence":"first","affiliation":[]},{"given":"Heegon","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Sukjin","family":"Kim","sequence":"additional","affiliation":[]},{"family":"Bumhee Bae","sequence":"additional","affiliation":[]},{"given":"Daniel H.","family":"Jung","sequence":"additional","affiliation":[]},{"family":"Sunkyu Kong","sequence":"additional","affiliation":[]},{"given":"Joungho","family":"Kim","sequence":"additional","affiliation":[]},{"family":"Junho Lee","sequence":"additional","affiliation":[]},{"family":"Kunwoo Park","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2012.6469404"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.149"},{"key":"5","first-page":"793","article-title":"On effective TSV repair for 3D-stacked ICs","volume":"2012","author":"jiang","year":"2012","journal-title":"Design Automation & Test in Europe Conference & Exhibition (DATE"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSISoC.2011.6081648"}],"event":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","start":{"date-parts":[[2013,12,15]]},"location":"Nara, Japan","end":{"date-parts":[[2013,12,18]]}},"container-title":["2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6729470\/6735156\/06735192.pdf?arnumber=6735192","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T21:17:45Z","timestamp":1490303865000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6735192\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,12]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/emccompo.2013.6735192","relation":{},"subject":[],"published":{"date-parts":[[2013,12]]}}}