{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,11]],"date-time":"2026-07-11T16:44:08Z","timestamp":1783788248070,"version":"3.55.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/emccompo.2015.7358326","type":"proceedings-article","created":{"date-parts":[[2015,12,17]],"date-time":"2015-12-17T16:59:17Z","timestamp":1450371557000},"page":"34-38","source":"Crossref","is-referenced-by-count":3,"title":["Bandgap failure study due to parasitic bipolar substrate coupling in Smart Power mixed ICs"],"prefix":"10.1109","author":[{"given":"V.","family":"Tomasevic","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"A.","family":"Boyer","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"S.","family":"Ben Dhia","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref4","author":"ben","year":"2006","journal-title":"Electromagnetic Compatibility of Integrated Circuits Techniques for Low Emission and Susceptibility"},{"key":"ref3","first-page":"1","author":"schenkel","year":"2003","journal-title":"Substrate Curent Effects in Smart Power ICs"},{"key":"ref6","author":"rincon-mora","year":"2009","journal-title":"From Diodes to Precision High-Order Bandgap"},{"key":"ref5","author":"grey","year":"2009","journal-title":"Analysis and Design of Analog Integrated Circuits"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"2433","DOI":"10.1109\/TPEL.2010.2048761","article-title":"A circuit-level substrate current model for smart-power ICs","volume":"25","author":"lo","year":"2010","journal-title":"IEEE Transactions on Power Electronics"},{"key":"ref1","year":"2015","journal-title":"The AUTOMICS web site"}],"event":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","location":"Edinburgh, United Kingdom","start":{"date-parts":[[2015,11,10]]},"end":{"date-parts":[[2015,11,13]]}},"container-title":["2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7352268\/7358224\/07358326.pdf?arnumber=7358326","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T21:56:46Z","timestamp":1498255006000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7358326\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/emccompo.2015.7358326","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}