{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,25]],"date-time":"2026-01-25T02:05:36Z","timestamp":1769306736598,"version":"3.49.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/emccompo.2015.7358332","type":"proceedings-article","created":{"date-parts":[[2015,12,17]],"date-time":"2015-12-17T21:59:17Z","timestamp":1450389557000},"page":"67-71","source":"Crossref","is-referenced-by-count":4,"title":["Methodology for interference analysis during early design stages of high-performance mixed-signal ICs"],"prefix":"10.1109","author":[{"given":"Sergei","family":"Kapora","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Marcel","family":"Hanssen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jan","family":"Niehof","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Quino","family":"Sandifort","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2003.1236727"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/b137864"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EMCCompo.2013.6735168"},{"key":"ref5","first-page":"62433","article-title":"EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)","year":"0"},{"key":"ref8","first-page":"106","article-title":"IC package modeling and characterization for RF applications","author":"yang","year":"0","journal-title":"Wescon 95"},{"key":"ref7","first-page":"62433","article-title":"EMC IC modelling - Part 4: Models of Integrated Circuits for RF Immunity behavioural simulation - Conducted Immunity modelling (ICIM-CI)","year":"0"},{"key":"ref2","first-page":"11","article-title":"Preventing RFIC interference issues: a modeling methodology for floorplan development and verification of isolation- and grounding strategies 2011","author":"niehof","year":"2011","journal-title":"8th IEEE Workshop on Signal Propagation on Interconnects (SPI)"},{"key":"ref1","year":"0","journal-title":"chapter SC 47A Integrated circuits"}],"event":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","location":"Edinburgh, United Kingdom","start":{"date-parts":[[2015,11,10]]},"end":{"date-parts":[[2015,11,13]]}},"container-title":["2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7352268\/7358224\/07358332.pdf?arnumber=7358332","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T01:21:11Z","timestamp":1490404871000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7358332\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/emccompo.2015.7358332","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}