{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T06:07:33Z","timestamp":1725430053723},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/emccompo.2015.7358344","type":"proceedings-article","created":{"date-parts":[[2015,12,17]],"date-time":"2015-12-17T21:59:17Z","timestamp":1450389557000},"page":"131-136","source":"Crossref","is-referenced-by-count":0,"title":["Near-field injection on a Safe System Basis Chip at silicon level"],"prefix":"10.1109","author":[{"given":"B.","family":"Vrignon","sequence":"first","affiliation":[]},{"given":"A.","family":"Doridant","sequence":"additional","affiliation":[]},{"given":"K.","family":"Abouda","sequence":"additional","affiliation":[]},{"given":"Y.","family":"Gao","sequence":"additional","affiliation":[]},{"given":"D.","family":"Pagnoux","sequence":"additional","affiliation":[]},{"given":"T.","family":"Marek","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1049\/el:20073130"},{"key":"ref3","first-page":"101","article-title":"Near field-Immunity Scan on Printed Circuit Board Level","author":"kroning","year":"0","journal-title":"Proc SPI"},{"journal-title":"MC33907\/08lae webpage","year":"0","key":"ref10"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2013.2280670"},{"key":"ref11","article-title":"Integrating the MPC5744P and MC33907\/08 for Safety Applications","author":"kulig","year":"2015","journal-title":"Freescale Semiconductor Application Note AN3059 Rev 0"},{"key":"ref5","first-page":"296","article-title":"IC's electromagnetic susceptibility: Comparison between a near-field injection method and a direct injection method","author":"castagnet","year":"0","journal-title":"Proc 3rd Int Conf Near-Field Characterization Imag"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/APEMC.2015.7175281"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2009.2023148"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/EMCEurope.2014.6930882"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.1992.626139"},{"journal-title":"ISO 26262 2011 Road vehicles - Functional safety","year":"0","key":"ref9"},{"journal-title":"IEC TS 62132–9 2014 Integrated circuits - Measurement of electromagnetic immunity - Part 9 Measurement of radiated immunity - Surface scan method","year":"0","key":"ref1"}],"event":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","start":{"date-parts":[[2015,11,10]]},"location":"Edinburgh, United Kingdom","end":{"date-parts":[[2015,11,13]]}},"container-title":["2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7352268\/7358224\/07358344.pdf?arnumber=7358344","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T01:44:31Z","timestamp":1490406271000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7358344\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/emccompo.2015.7358344","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}