{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T16:26:07Z","timestamp":1730219167952,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/emccompo.2015.7358359","type":"proceedings-article","created":{"date-parts":[[2015,12,17]],"date-time":"2015-12-17T16:59:17Z","timestamp":1450371557000},"page":"212-215","source":"Crossref","is-referenced-by-count":1,"title":["TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC"],"prefix":"10.1109","author":[{"given":"Jonghoon J.","family":"Kim","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daniel H.","family":"Jung","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Heegon","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sunkyu","family":"Kong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sumin","family":"Choi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jaemin","family":"Lim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Joungho","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","article-title":"IC noise source for dynamic PDN assessment","author":"kim","year":"2011","journal-title":"Proc DesignCon Santa Clara CA USA"},{"key":"ref3","first-page":"153","article-title":"Embedded toroidal magnetic coupling probe in multilayer PCBs for current measurement in Electrical Performance of Electronic Packaging and Systems (EPEPS)","author":"kim","year":"2012","journal-title":"2012 21st International Conference On IEEE"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2014.7152151"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2012.6469422"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2362130"},{"key":"ref1","first-page":"277","article-title":"Analysis of radiation caused by SSN and transmission line by combining the equivalent circuits of active IC into FDTD in Electromagnetic Compatibility, 2004","volume":"1","author":"lin","year":"2004","journal-title":"EMC 2004 2004 InternationalSymposium on"}],"event":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","start":{"date-parts":[[2015,11,10]]},"location":"Edinburgh, United Kingdom","end":{"date-parts":[[2015,11,13]]}},"container-title":["2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7352268\/7358224\/07358359.pdf?arnumber=7358359","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T21:44:31Z","timestamp":1490391871000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7358359\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/emccompo.2015.7358359","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}