{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T15:21:45Z","timestamp":1759332105848,"version":"3.28.2"},"reference-count":40,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,7]],"date-time":"2024-10-07T00:00:00Z","timestamp":1728259200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,7]],"date-time":"2024-10-07T00:00:00Z","timestamp":1728259200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,7]]},"DOI":"10.1109\/emccompo61192.2024.10742027","type":"proceedings-article","created":{"date-parts":[[2024,11,6]],"date-time":"2024-11-06T18:38:15Z","timestamp":1730918295000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Common Mode Noise Reduction Methods Used for High Power Density DC\/DC Converters"],"prefix":"10.1109","author":[{"given":"Jun","family":"Imaoka","sequence":"first","affiliation":[{"name":"Nagoya University,Institute of Materials and Systems for Sustainability (IMaSS),Nagoya,Japan"}]},{"given":"Mamoru","family":"Sasaki","sequence":"additional","affiliation":[{"name":"Virginia Polytechnic Institute and State University,Center for Power Electronics Systems,Blacksburg,USA"}]},{"given":"Yasumichi","family":"Omoto","sequence":"additional","affiliation":[{"name":"Nagoya University,Department of Electrical Engineering,Nagoya,Japan"}]},{"given":"Mostafa","family":"Noah","sequence":"additional","affiliation":[{"name":"Nagoya University,Institute of Materials and Systems for Sustainability (IMaSS),Nagoya,Japan"}]},{"given":"Koichi","family":"Shigematsu","sequence":"additional","affiliation":[{"name":"Nagoya University,Institute of Materials and Systems for Sustainability (IMaSS),Nagoya,Japan"}]},{"given":"Masayoshi","family":"Yamamoto","sequence":"additional","affiliation":[{"name":"Nagoya University,Institute of Materials and Systems for Sustainability (IMaSS),Nagoya,Japan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2733451"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.est.2020.101982"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2017.2705914"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjia.21007126"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICDCM45535.2019.9232868"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2019.2933513"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3009600"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3243432"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3135083"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjia.8.608"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/OJPEL.2022.3166684"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2023.3319996"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/APEC48139.2024.10509216"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE-Asia49820.2021.9479365"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.4028\/www.scientific.net\/MSF.821-823.884"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjia.2.161"},{"article-title":"Power Density vs. Efficiency of Power Electronics","volume-title":"Proc. 10 Years ECPE Anniversary","author":"Kolar","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2047734"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2017.8096456"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/APEC48139.2024.10509463"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2004.826527"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1002\/ecj.12305"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3172388"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2003.819677"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2000.826102"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2049708"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.4271\/2015-01-1170"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/PESC.2007.4342188"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.egyr.2023.10.056"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3130681"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjia.7.218"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2018.2835812"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjia.2.252"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.4271\/2019-01-2311"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/63.931059"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1049\/pel2.12226"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjia.22007783"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1002\/eej.23439"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1541\/ieejjia.22008018"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/APEC48139.2024.10509471"}],"event":{"name":"2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","start":{"date-parts":[[2024,10,7]]},"location":"Torino, Italy","end":{"date-parts":[[2024,10,9]]}},"container-title":["2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10741960\/10742012\/10742027.pdf?arnumber=10742027","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T13:06:31Z","timestamp":1732712791000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10742027\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,7]]},"references-count":40,"URL":"https:\/\/doi.org\/10.1109\/emccompo61192.2024.10742027","relation":{},"subject":[],"published":{"date-parts":[[2024,10,7]]}}}