{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,11,28]],"date-time":"2024-11-28T05:27:47Z","timestamp":1732771667187,"version":"3.29.0"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,7]],"date-time":"2024-10-07T00:00:00Z","timestamp":1728259200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,7]],"date-time":"2024-10-07T00:00:00Z","timestamp":1728259200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,7]]},"DOI":"10.1109\/emccompo61192.2024.10742043","type":"proceedings-article","created":{"date-parts":[[2024,11,6]],"date-time":"2024-11-06T18:38:15Z","timestamp":1730918295000},"page":"24-28","source":"Crossref","is-referenced-by-count":0,"title":["Evaluation of Ground Terminal against Noise by Direct Power Injection Method"],"prefix":"10.1109","author":[{"given":"Takashi","family":"Nomura","sequence":"first","affiliation":[{"name":"DENSO Corporation,Semiconductor Platform R&#x0026;D Division,Kariya,Japan"}]},{"given":"Mitsuhiro","family":"Hasegawa","sequence":"additional","affiliation":[{"name":"DENSO Corporation,Semiconductor Platform R&#x0026;D Division,Kariya,Japan"}]},{"given":"Ko","family":"Oyama","sequence":"additional","affiliation":[{"name":"DENSO Corporation,Semiconductor Platform R&#x0026;D Division,Kariya,Japan"}]},{"given":"Yosuke","family":"Kondo","sequence":"additional","affiliation":[{"name":"DENSO Corporation,Semiconductor Platform R&#x0026;D Division,Kariya,Japan"}]},{"given":"Koji","family":"Ichikawa","sequence":"additional","affiliation":[{"name":"Nagoya Institute of Technology,Center for Future Communications Research,Nagoya,Japan"}]}],"member":"263","reference":[{"volume-title":"IEC 62132-4 : Integrated circuits \u2013Mesurement of electromagnetic immunity 150 kHz to 1 GHz \u2013 Part 4:Direct RF power injection method","year":"2006","key":"ref1"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2003.1236600"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2008.4652068"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2023.3271440"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1166\/jolpe.2019.1624"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EMCCompo.2017.7998103"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2016.2570560"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/EMCEurope.2017.8094624"},{"article-title":"Method of making a reference voltage source with a desired temperature coefficient","volume-title":"US patent","year":"1975","key":"ref9"}],"event":{"name":"2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","start":{"date-parts":[[2024,10,7]]},"location":"Torino, Italy","end":{"date-parts":[[2024,10,9]]}},"container-title":["2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10741960\/10742012\/10742043.pdf?arnumber=10742043","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T13:09:53Z","timestamp":1732712993000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10742043\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,7]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/emccompo61192.2024.10742043","relation":{},"subject":[],"published":{"date-parts":[[2024,10,7]]}}}