{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,31]],"date-time":"2026-03-31T14:47:55Z","timestamp":1774968475543,"version":"3.50.1"},"reference-count":4,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,7]],"date-time":"2024-10-07T00:00:00Z","timestamp":1728259200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,7]],"date-time":"2024-10-07T00:00:00Z","timestamp":1728259200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100006190","name":"Research and Development","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100006190","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,7]]},"DOI":"10.1109\/emccompo61192.2024.10742064","type":"proceedings-article","created":{"date-parts":[[2024,11,6]],"date-time":"2024-11-06T18:38:15Z","timestamp":1730918295000},"page":"96-99","source":"Crossref","is-referenced-by-count":1,"title":["STT-MRAM Based ESD and EFT Immunity Analysis"],"prefix":"10.1109","author":[{"given":"Jianfei","family":"Wu","sequence":"first","affiliation":[{"name":"National University of Defense Technology,College of Electronic Science,Changsha,China"}]},{"given":"Yanfang","family":"Lu","sequence":"additional","affiliation":[{"name":"Tianjin Institute of Advanced Technology,Tianjin,China"}]},{"given":"Yang","family":"Li","sequence":"additional","affiliation":[{"name":"Tianjin Institute of Advanced Technology,Tianjin,China"}]},{"given":"Hongli","family":"Zhang","sequence":"additional","affiliation":[{"name":"Tianjin Institute of Advanced Technology,Tianjin,China"}]},{"given":"Yiming","family":"Zhang","sequence":"additional","affiliation":[{"name":"Hebei University of Technology,School of Electronics and Information Engineering,Tianjin,China"}]},{"given":"Xing","family":"Zhao","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of Chinese Academy of Sciences,Beijing,China"}]},{"given":"Wei","family":"Zhu","sequence":"additional","affiliation":[{"name":"Guangdong Dawan District Institute of Integrated Circuit and System Application,Guangzhou,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993551"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2013.6572079"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/20.908581"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2332247"}],"event":{"name":"2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","location":"Torino, Italy","start":{"date-parts":[[2024,10,7]]},"end":{"date-parts":[[2024,10,9]]}},"container-title":["2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10741960\/10742012\/10742064.pdf?arnumber=10742064","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T13:13:27Z","timestamp":1732713207000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10742064\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,7]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/emccompo61192.2024.10742064","relation":{},"subject":[],"published":{"date-parts":[[2024,10,7]]}}}