{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,14]],"date-time":"2025-04-14T04:26:16Z","timestamp":1744604776962},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/esscirc.2003.1257121","type":"proceedings-article","created":{"date-parts":[[2004,7,20]],"date-time":"2004-07-20T14:08:28Z","timestamp":1090332508000},"page":"257-260","source":"Crossref","is-referenced-by-count":4,"title":["Digital circuit capacitance and switching analysis for ground bounce in ICs with a high-ohmic substrate"],"prefix":"10.1109","author":[{"given":"M.","family":"Badaroglu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"L.","family":"Balasubramanian","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.","family":"Tiri","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"V.","family":"Gravot","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.","family":"Wambacq","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Van der Plas","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Donnay","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Gielen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"De Man","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/4.509856"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/4.210024"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1007\/b105382"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/4.98995"},{"year":"0","key":"6"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2002.803938"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/4.910486"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/4.52187"}],"event":{"name":"ESSCIRC 2004 - 29th European Solid-State Circuits Conference","acronym":"ESSCIR-03","location":"Estoril, Portugal"},"container-title":["ESSCIRC 2004 - 29th European Solid-State Circuits Conference (IEEE Cat. No.03EX705)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8892\/28114\/01257121.pdf?arnumber=1257121","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T01:46:51Z","timestamp":1489456011000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1257121\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/esscirc.2003.1257121","relation":{},"subject":[]}}