{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,23]],"date-time":"2026-01-23T07:30:37Z","timestamp":1769153437128,"version":"3.49.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,9]]},"DOI":"10.1109\/esscirc.2017.8094512","type":"proceedings-article","created":{"date-parts":[[2017,11,28]],"date-time":"2017-11-28T11:03:53Z","timestamp":1511867033000},"page":"7-10","source":"Crossref","is-referenced-by-count":3,"title":["A frequency-locked loop based on an oxide electrothermal filter in standard CMOS"],"prefix":"10.1109","author":[{"given":"Lorenzo","family":"Pedala","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cagri","family":"Gurleyuk","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sining","family":"Pan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fabio","family":"Sebastiano","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kofi A. A.","family":"Makinwa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1002\/pssa.2210750223"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2191043"},{"key":"ref6","first-page":"158","article-title":"A Resistor-Based Termperature Sensor with a 0.13 pJ.K2 Resolution FOM","author":"pan","year":"2017","journal-title":"IEEE ISSCC Dig Tech Papers"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2016.7808512"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.858476"},{"key":"ref7","first-page":"395","article-title":"A 0.008-mm2 Area-Optimized Thermal-Diffusivity-Based Temperature Sensor in 160-nm CMOS for SoC Thermal Monitoring","author":"s\u00f6nmez","year":"2014","journal-title":"Proc ESSCIRC"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2021914"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/FCS.2012.6243676"}],"event":{"name":"ESSCIRC 2017 - 43rd IEEE European Solid-State Circuits Conference","location":"Leuven","start":{"date-parts":[[2017,9,11]]},"end":{"date-parts":[[2017,9,14]]}},"container-title":["ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8061155\/8094509\/08094512.pdf?arnumber=8094512","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,2,12]],"date-time":"2018-02-12T17:54:19Z","timestamp":1518458059000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8094512\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,9]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/esscirc.2017.8094512","relation":{},"subject":[],"published":{"date-parts":[[2017,9]]}}}