{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,22]],"date-time":"2026-01-22T07:44:49Z","timestamp":1769067889605,"version":"3.49.0"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,9,19]],"date-time":"2022-09-19T00:00:00Z","timestamp":1663545600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,9,19]],"date-time":"2022-09-19T00:00:00Z","timestamp":1663545600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,9,19]]},"DOI":"10.1109\/esscirc55480.2022.9911452","type":"proceedings-article","created":{"date-parts":[[2022,11,3]],"date-time":"2022-11-03T17:58:34Z","timestamp":1667498314000},"page":"497-500","source":"Crossref","is-referenced-by-count":7,"title":["A 112-Gb\/s Single-Ended PAM-4 Transceiver Front-End for Reach Extension in Long-Reach Link"],"prefix":"10.1109","author":[{"given":"Xiongshi","family":"Luo","sequence":"first","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuewei","family":"You","sequence":"additional","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiahan","family":"Fu","sequence":"additional","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhenghao","family":"Li","sequence":"additional","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liping","family":"Zhong","sequence":"additional","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Taiyang","family":"Fan","sequence":"additional","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhang","family":"Qiu","sequence":"additional","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wenbo","family":"Xiao","sequence":"additional","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yong","family":"Chen","sequence":"additional","affiliation":[{"name":"University of Macau,State-Key Laboratory of Analog and Mixed-Signal VLSI and IME\/ECE-FST,Macao,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Quan","family":"Pan","sequence":"additional","affiliation":[{"name":"School of Microelectronics Engineering, Research Center of Integrated Circuits for Next-Generation Communications, Southern University of Science and Technology,Shenzhen,China,518055"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366048"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063137"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365997"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2018.8494318"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662462"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC53450.2021.9567801"}],"event":{"name":"ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)","location":"Milan, Italy","start":{"date-parts":[[2022,9,19]]},"end":{"date-parts":[[2022,9,22]]}},"container-title":["ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9911257\/9911222\/09911452.pdf?arnumber=9911452","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,2,27]],"date-time":"2023-02-27T18:27:02Z","timestamp":1677522422000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9911452\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,9,19]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/esscirc55480.2022.9911452","relation":{},"subject":[],"published":{"date-parts":[[2022,9,19]]}}}