{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,3]],"date-time":"2025-05-03T05:14:46Z","timestamp":1746249286362},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,11]]},"DOI":"10.1109\/esscirc59616.2023.10268751","type":"proceedings-article","created":{"date-parts":[[2023,10,6]],"date-time":"2023-10-06T17:46:43Z","timestamp":1696614403000},"page":"73-76","source":"Crossref","is-referenced-by-count":3,"title":["A 137-GHz Ultra-Wide Bandwidth High-Linearity CMOS Distributed Amplifier for High-Speed Communication"],"prefix":"10.1109","author":[{"given":"Dongwon","family":"Lee","sequence":"first","affiliation":[{"name":"ETH Zurich,Department of Information Technology and Electrical Engineering,Zurich,Switzerland"}]},{"given":"Jeongsoo","family":"Park","sequence":"additional","affiliation":[{"name":"ETH Zurich,Department of Information Technology and Electrical Engineering,Zurich,Switzerland"}]},{"given":"Kyung-Sik","family":"Choi","sequence":"additional","affiliation":[{"name":"ETH Zurich,Department of Information Technology and Electrical Engineering,Zurich,Switzerland"}]},{"given":"Yuqi","family":"Liu","sequence":"additional","affiliation":[{"name":"ETH Zurich,Department of Information Technology and Electrical Engineering,Zurich,Switzerland"}]},{"given":"Hua","family":"Wang","sequence":"additional","affiliation":[{"name":"ETH Zurich,Department of Information Technology and Electrical Engineering,Zurich,Switzerland"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2875981"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2020.3001261"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2271614"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3197436"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3020229"}],"event":{"name":"ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC)","start":{"date-parts":[[2023,9,11]]},"location":"Lisbon, Portugal","end":{"date-parts":[[2023,9,14]]}},"container-title":["ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10268677\/10268683\/10268751.pdf?arnumber=10268751","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,10,23]],"date-time":"2023-10-23T17:52:57Z","timestamp":1698083577000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10268751\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,11]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/esscirc59616.2023.10268751","relation":{},"subject":[],"published":{"date-parts":[[2023,9,11]]}}}