{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,23]],"date-time":"2025-05-23T04:46:48Z","timestamp":1747975608200,"version":"3.28.0"},"reference-count":13,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,9]]},"DOI":"10.1109\/essderc.2013.6818841","type":"proceedings-article","created":{"date-parts":[[2014,5,30]],"date-time":"2014-05-30T14:34:21Z","timestamp":1401460461000},"page":"151-154","source":"Crossref","is-referenced-by-count":9,"title":["Novel low temperature 3D wafer stacking technology for high density device integration"],"prefix":"10.1109","author":[{"given":"I.","family":"Radu","sequence":"first","affiliation":[]},{"given":"G.","family":"Gaudin","sequence":"additional","affiliation":[]},{"given":"W.","family":"van den Daele","sequence":"additional","affiliation":[]},{"given":"F.","family":"Letertre","sequence":"additional","affiliation":[]},{"given":"C.","family":"Mazure","sequence":"additional","affiliation":[]},{"given":"L.","family":"Di Cioccio","sequence":"additional","affiliation":[]},{"given":"T.","family":"Lacave","sequence":"additional","affiliation":[]},{"given":"F.","family":"Mazen","sequence":"additional","affiliation":[]},{"given":"P.","family":"Scheiblin","sequence":"additional","affiliation":[]},{"given":"T.","family":"Signamarcheix","sequence":"additional","affiliation":[]},{"given":"S.","family":"Cristoloveanu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"13","doi-asserted-by":"crossref","first-page":"694","DOI":"10.1109\/IIT.2002.1258100","author":"graoui","year":"2002","journal-title":"Proceedings of the 14th International Conference on Ion Implantation Technology"},{"key":"11","article-title":"Electrical characterization of thin doped silicon films obtained by low temperature Smart CutTM","author":"gaudin","year":"2013","journal-title":"Solid State Electronics"},{"key":"12","doi-asserted-by":"crossref","first-page":"13528","DOI":"10.1063\/1.3041653","volume":"105","author":"koffel","year":"2009","journal-title":"J Appl Phys"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424352"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/55.988821"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2006.346902"},{"key":"10","first-page":"255","volume":"3","author":"olson","year":"1994","journal-title":"Handbook of Crystal Growth"},{"key":"7","article-title":"Wafer Level 3D Stacking using Smart CutTM and Metal-Metal Direct Bonding Technology","author":"di cioccio","year":"0","journal-title":"Semiconductor Wafer Bonding 12 Science Technology and Applications Electrochem Soc Meeting 2012 Honolulu Oct 7-12"},{"key":"6","first-page":"20","article-title":"Building Blocks for Wafer Level 3D Integration","volume":"52","author":"sadaka","year":"2009","journal-title":"Solid State Technology"},{"key":"5","first-page":"13","article-title":"Thin film transfer by Smart Cut\ufffd technology beyond SOI","volume":"5","author":"mazure","year":"2003","journal-title":"Proceedings Electrochem Soc Silicon-on-insulator Technology and Devices"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1049\/el:19950805"},{"key":"9","doi-asserted-by":"crossref","first-page":"299","DOI":"10.1023\/A:1023963626033","article-title":"Transfer of thin Si layers by cold and thermal ion cutting","volume":"14","author":"henttinen","year":"2003","journal-title":"J Mat Sci Materials in Electronics"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1134\/1.1309421"}],"event":{"name":"ESSDERC 2013 - 43rd European Solid State Device Research Conference","start":{"date-parts":[[2013,9,16]]},"location":"Bucharest, Romania","end":{"date-parts":[[2013,9,20]]}},"container-title":["2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6811819\/6818804\/06818841.pdf?arnumber=6818841","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,22]],"date-time":"2017-06-22T10:07:25Z","timestamp":1498126045000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6818841\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,9]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/essderc.2013.6818841","relation":{},"subject":[],"published":{"date-parts":[[2013,9]]}}}