{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,8]],"date-time":"2025-10-08T16:01:23Z","timestamp":1759939283394,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,9]]},"DOI":"10.1109\/essderc.2014.6948797","type":"proceedings-article","created":{"date-parts":[[2014,11,12]],"date-time":"2014-11-12T17:53:35Z","timestamp":1415814815000},"page":"210-213","source":"Crossref","is-referenced-by-count":11,"title":["Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips"],"prefix":"10.1109","author":[{"given":"Christine","family":"Harendt","sequence":"first","affiliation":[]},{"given":"Zili","family":"Yu","sequence":"additional","affiliation":[]},{"given":"Joachim N.","family":"Burghartz","sequence":"additional","affiliation":[]},{"given":"Jan","family":"Kostelnik","sequence":"additional","affiliation":[]},{"given":"Andreas","family":"Kugler","sequence":"additional","affiliation":[]},{"given":"Stefan","family":"Saller","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"17","article-title":"Bionic handling assistant ref. Brochure","author":"festo","year":"2013","journal-title":"Bionic Handling Assistant"},{"key":"15","first-page":"32","article-title":"Development of printed thin and flexible batteries","author":"wendler","year":"2011","journal-title":"IC International Circular of Graphic Education and Research Hsgb The International Circle of Educational Institutes for Graphic Arts Technology and Management"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1108\/01445151111172907"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2170639"},{"key":"14","first-page":"1","article-title":"Innovations in active matrix OLED and flexible displays","author":"fruehauf","year":"0","journal-title":"Proceedings of AM-FPD 10"},{"key":"11","first-page":"1","article-title":"Assembly and embedding of ultra-thin chips in polymers","volume":"9","author":"hassan","year":"2013","journal-title":"EMPC Grenoble France September"},{"key":"12","article-title":"Printing of functional silver structures on polymer based 3dpackages","author":"matic","year":"2012","journal-title":"Proc 9th Intern 4M Conf"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2005.851513"},{"year":"0","key":"2"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1038\/srep01786"},{"key":"10","article-title":"Ultra-thin silicon chips in flexible microsystems","author":"wolf","year":"2014","journal-title":"ECWC13"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2010.5703284"},{"key":"6","first-page":"1","article-title":"Ultrathin Si Chips for Flexible Electronics Process Technology, Characterization, Assembly and Applications","author":"burghartz","year":"2013","journal-title":"Proc Symp SBMicro"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2006.1645874"},{"key":"4","article-title":"Make way for flexible silicon chips","volume":"3","author":"burghartz","year":"2013","journal-title":"IEEE Spectrum"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2011.2178389"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2012.04.019"}],"event":{"name":"ESSDERC 2014 - 44th European Solid State Device Research Conference","start":{"date-parts":[[2014,9,22]]},"location":"Venice Lido, Italy","end":{"date-parts":[[2014,9,26]]}},"container-title":["2014 44th European Solid State Device Research Conference (ESSDERC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6926646\/6948742\/06948797.pdf?arnumber=6948797","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T00:42:49Z","timestamp":1490316169000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6948797\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,9]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/essderc.2014.6948797","relation":{},"subject":[],"published":{"date-parts":[[2014,9]]}}}