{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,3]],"date-time":"2026-04-03T02:37:28Z","timestamp":1775183848844,"version":"3.50.1"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,9]]},"DOI":"10.1109\/essderc.2017.8066629","type":"proceedings-article","created":{"date-parts":[[2017,10,25]],"date-time":"2017-10-25T20:13:21Z","timestamp":1508962401000},"page":"212-215","source":"Crossref","is-referenced-by-count":36,"title":["WS&lt;inf&gt;2&lt;\/inf&gt; transistors on 300 mm wafers with BEOL compatibility"],"prefix":"10.1109","author":[{"given":"T.","family":"Schram","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Q.","family":"Smets","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"B.","family":"Groven","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M. H.","family":"Heyne","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"E.","family":"Kunnen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Thiam","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.","family":"Devriendt","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Delabie","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.","family":"Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Lux","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.","family":"Chiappe","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"I.","family":"Asselberghs","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Brus","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Huyghebaert","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Sayan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Juncker","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Caymax","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"I. P.","family":"Radu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"15692","article-title":"Low temperature deposition of 2D WS 2 layers from WF 6 and H 2 S precursors: impact of reducing agents","volume":"51","author":"delabie","year":"2015","journal-title":"Chem Commun"},{"key":"ref3","first-page":"4lt01","article-title":"Two-dimensional WS 2 nanoribbon deposition by conversion of pre-patterned amorphous silicon","volume":"28","author":"heyne","year":"2017","journal-title":"Nanotechnology"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/nature14417"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1021\/nl202613t"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1021\/acs.chemmater.6b05214"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.4789365"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1038\/srep01755"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.tsf.2016.08.068"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1038\/srep01866"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1021\/nn400280c"}],"event":{"name":"ESSDERC 2017 - 47th IEEE European Solid-State Device Research Conference (ESSDERC)","location":"Leuven, Belgium","start":{"date-parts":[[2017,9,11]]},"end":{"date-parts":[[2017,9,14]]}},"container-title":["2017 47th European Solid-State Device Research Conference (ESSDERC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8059714\/8066575\/08066629.pdf?arnumber=8066629","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,10,28]],"date-time":"2017-10-28T03:28:29Z","timestamp":1509161309000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8066629\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,9]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/essderc.2017.8066629","relation":{},"subject":[],"published":{"date-parts":[[2017,9]]}}}