{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,28]],"date-time":"2026-02-28T23:38:17Z","timestamp":1772321897760,"version":"3.50.1"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2018,9,1]],"date-time":"2018-09-01T00:00:00Z","timestamp":1535760000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2018,9,1]],"date-time":"2018-09-01T00:00:00Z","timestamp":1535760000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,9]]},"DOI":"10.1109\/essderc.2018.8486890","type":"proceedings-article","created":{"date-parts":[[2018,10,18]],"date-time":"2018-10-18T14:50:05Z","timestamp":1539874205000},"page":"58-61","source":"Crossref","is-referenced-by-count":11,"title":["Towards Automotive Grade Embedded RRAM"],"prefix":"10.1109","author":[{"given":"J.R.","family":"Jameson","sequence":"first","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"J.","family":"Dinh","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"N.","family":"Gonzales","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"S.","family":"Hollmer","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"S.","family":"Hsu","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"D.","family":"Kim","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"F.","family":"Koushan","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"D.","family":"Lewis","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"E.","family":"Runnion","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"J.","family":"Shields","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"A.","family":"Tysdal","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"D.","family":"Wang","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]},{"given":"V.","family":"Gopinath","sequence":"additional","affiliation":[{"name":"Adesto Technologies Corporation, Santa Clara, USA"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","first-page":"1770","DOI":"10.1109\/JPROC.2017.2684830","volume":"105","author":"wu","year":"0","journal-title":"Proc IEEE"},{"key":"ref3","first-page":"2. 6. 1","author":"ho","year":"0","journal-title":"IEDM 2017 Tech Digest"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"53505","DOI":"10.1063\/1.4941303","volume":"108","author":"jameson","year":"2016","journal-title":"Appl Phys Lett"},{"key":"ref5","year":"2007","journal-title":"AEC-QI00-Rev-G Automotive Electronics Council"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"34","DOI":"10.1016\/j.apsusc.2017.07.187","volume":"432","author":"mendes","year":"2018","journal-title":"Appl Surface Sci"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"41","DOI":"10.1149\/07505.0041ecst","volume":"75","author":"jameson","year":"2016","journal-title":"ECS Trans"},{"key":"ref1","year":"0"}],"event":{"name":"ESSDERC 2018 - 48th European Solid-State Device Research Conference (ESSDERC)","location":"Dresden, Germany","start":{"date-parts":[[2018,9,3]]},"end":{"date-parts":[[2018,9,6]]}},"container-title":["2018 48th European Solid-State Device Research Conference (ESSDERC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8476153\/8486846\/08486890.pdf?arnumber=8486890","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,4]],"date-time":"2025-08-04T18:38:15Z","timestamp":1754332695000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8486890\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,9]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/essderc.2018.8486890","relation":{},"subject":[],"published":{"date-parts":[[2018,9]]}}}