{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:14:01Z","timestamp":1740100441392,"version":"3.37.3"},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,9,13]],"date-time":"2021-09-13T00:00:00Z","timestamp":1631491200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,9,13]],"date-time":"2021-09-13T00:00:00Z","timestamp":1631491200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,9,13]],"date-time":"2021-09-13T00:00:00Z","timestamp":1631491200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100002830","name":"CNES","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002830","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100006291","name":"ESA","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100006291","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,9,13]]},"DOI":"10.1109\/essderc53440.2021.9631779","type":"proceedings-article","created":{"date-parts":[[2021,12,13]],"date-time":"2021-12-13T21:10:04Z","timestamp":1639429804000},"page":"35-42","source":"Crossref","is-referenced-by-count":0,"title":["The essential contribution of CMOS imaging technologies to Earth Observation applications"],"prefix":"10.1109","author":[{"given":"Pierre","family":"Magnan","sequence":"first","affiliation":[]}],"member":"263","reference":[{"journal-title":"Image Sensor Workshop","article-title":"Digital multispectral TDI CMOS detector for earth observation","year":"2019","key":"ref10"},{"key":"ref11","article-title":"A 256 stage Charge Domain TDI CMOS imager with 12-bit column parallel ADC supporting up to 300 kHz line rate","author":"korthout","year":"2017","journal-title":"Image Sensor Workshop"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2020.3014431"},{"key":"ref13","article-title":"Vertical Deep Trench MOS Capacitance principle and application to CMOS Image Sensors","author":"roy","year":"0","journal-title":"ESSDERC 2020 Workshop Emerging Solutions for Imaging Devices Circuits and Systems"},{"key":"ref14","article-title":"47 MPixel 36.4 x 27.6 mm2 30 fps Global Shutter Image Sensor","author":"meynants","year":"2017","journal-title":"2017 International Image Sensor Workshop"},{"key":"ref15","article-title":"SkySat-1: Very High-Resolution Imagery from a Small Satellite","author":"murthy","year":"2014","journal-title":"Proceedings of the SPIE on Remote Sensing"},{"key":"ref16","article-title":"CHIEM: A hyperspectral image sensor for the miniaturized earth observation instrument CHIEM","author":"tack","year":"2019","journal-title":"Image Sensor Workshop"},{"key":"ref17","article-title":"ST CIS BSI Technology - From mobile phone market to spatial application","author":"huss","year":"2019","journal-title":"Image Sensor Workshop"},{"key":"ref4","article-title":"Pixel-to-Pixel Isolation by Deep Trench Technology: Application to CMOS Image Sensor","author":"tournier","year":"2011","journal-title":"2011 Int Image Sensor Workshop"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.rse.2017.10.022"},{"key":"ref6","article-title":"13 & $26\\mu{\\mathrm{m}}$ pixel results on latest STMicroelectronics FSI technology","author":"lachaud","year":"2013","journal-title":"CNES Workshop CMOS Image Sensors for High Perform Appl"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046979"},{"key":"ref8","article-title":"Radiation Effects in Pinned Photodiode CMOS Image Sensors: Variation of epitaxial layer thickness","author":"virmontois","year":"2016","journal-title":"NSREC 2016 Conference"},{"key":"ref7","article-title":"CNES developments of key detection technologies to prepare next generation focal planes for high resolution Earth observation","author":"materne","year":"0","journal-title":"Proceedings of the SPIE on Remote Sensing"},{"key":"ref2","article-title":"VNIR Focal Plane results from the multispectral instrument of the sentine12 mission","author":"espuche","year":"2014","journal-title":"International Conference on Space Optic (ICSO) 2014 Tenerife"},{"key":"ref1","article-title":"From SED HI concept To Pleiades FM Detection Unit Measurements","author":"renard","year":"2008","journal-title":"Proc Internat Conf on Space Optics"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2030648"}],"event":{"name":"ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC)","start":{"date-parts":[[2021,9,13]]},"location":"Grenoble, France","end":{"date-parts":[[2021,9,22]]}},"container-title":["ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9631379\/9631380\/09631779.pdf?arnumber=9631779","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T16:54:09Z","timestamp":1652201649000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9631779\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,9,13]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/essderc53440.2021.9631779","relation":{},"subject":[],"published":{"date-parts":[[2021,9,13]]}}}