{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T19:48:57Z","timestamp":1783712937853,"version":"3.55.0"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,9,19]],"date-time":"2022-09-19T00:00:00Z","timestamp":1663545600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,9,19]],"date-time":"2022-09-19T00:00:00Z","timestamp":1663545600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,9,19]]},"DOI":"10.1109\/essderc55479.2022.9947198","type":"proceedings-article","created":{"date-parts":[[2022,11,18]],"date-time":"2022-11-18T15:49:46Z","timestamp":1668786586000},"page":"352-355","source":"Crossref","is-referenced-by-count":14,"title":["The Environmental Footprint of IC Production: Meta-Analysis and Historical Trends"],"prefix":"10.1109","author":[{"given":"Thibault","family":"Pirson","sequence":"first","affiliation":[{"name":"ICTEAM Institute"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Thibault","family":"Delhaye","sequence":"additional","affiliation":[{"name":"ICTEAM Institute"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Alex","family":"Pip","sequence":"additional","affiliation":[{"name":"IMMC Institute, Université catholique de Louvain,Belgium"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Gregoire","family":"Le Brun","sequence":"additional","affiliation":[{"name":"ICTEAM Institute"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jean-Pierre","family":"Raskin","sequence":"additional","affiliation":[{"name":"ICTEAM Institute"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"David","family":"Bol","sequence":"additional","affiliation":[{"name":"ICTEAM Institute"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","first-page":"41","article-title":"DTCO including sustainability: Power-performance-area-cost-environmental score (PPACE) analysis for logic technologies","author":"bardon","year":"0","journal-title":"2020 IEEE International Electron Devices Meeting (IEDM)"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9474110"},{"key":"ref12","first-page":"217","article-title":"Substituting computers for services-potential to reduce ICT's environmental footprint","author":"plepys","year":"2004","journal-title":"Joint International Congress and Exhibition Electronics Goes Green 2000"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-09228-7_26"},{"key":"ref14","article-title":"Global warming of 1.5°C","author":"masson-delmotte","year":"2018","journal-title":"IPCC Special Report"},{"key":"ref4","doi-asserted-by":"crossref","first-page":"106416","DOI":"10.1016\/j.eiar.2020.106416","article-title":"Sources of variation in life cycle as-sessments of smartphones and tablet computers","volume":"84","author":"louis-philippe","year":"2020","journal-title":"Environmental Impact Assessment Review"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.patter.2021.100340"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.compind.2013.10.003"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.jclepro.2021.128966"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISEE.2004.1299707"},{"key":"ref7","article-title":"I. O. for Standardization","year":"2006","journal-title":"ISO 14044 2006"},{"key":"ref2","article-title":"IDC","year":"2018","journal-title":"Global ICT Spending Forecast 2020-2023"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISEE.2008.4562888"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-9988-7"}],"event":{"name":"ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC)","location":"Milan, Italy","start":{"date-parts":[[2022,9,19]]},"end":{"date-parts":[[2022,9,22]]}},"container-title":["ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9947060\/9947094\/09947198.pdf?arnumber=9947198","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,12]],"date-time":"2022-12-12T14:56:45Z","timestamp":1670857005000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9947198\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,9,19]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/essderc55479.2022.9947198","relation":{},"subject":[],"published":{"date-parts":[[2022,9,19]]}}}