{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,19]],"date-time":"2026-02-19T02:08:39Z","timestamp":1771466919818,"version":"3.50.1"},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T00:00:00Z","timestamp":1694390400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,11]]},"DOI":"10.1109\/essderc59256.2023.10268572","type":"proceedings-article","created":{"date-parts":[[2023,10,2]],"date-time":"2023-10-02T13:46:40Z","timestamp":1696254400000},"page":"69-72","source":"Crossref","is-referenced-by-count":5,"title":["Understanding Distance-Dependent Variations for Analog Circuits in a FinFET Technology"],"prefix":"10.1109","author":[{"given":"Meghna","family":"Madhusudan","sequence":"first","affiliation":[{"name":"University of Minnesota,ECE Department,Minneapolis,MN,USA"}]},{"given":"Jitesh","family":"Poojary","sequence":"additional","affiliation":[{"name":"University of Minnesota,ECE Department,Minneapolis,MN,USA"}]},{"given":"Arvind K.","family":"Sharma","sequence":"additional","affiliation":[{"name":"University of Minnesota,ECE Department,Minneapolis,MN,USA"}]},{"given":"Ramprasath","family":"S.","sequence":"additional","affiliation":[{"name":"University of Minnesota,ECE Department,Minneapolis,MN,USA"}]},{"given":"Kishor","family":"Kunal","sequence":"additional","affiliation":[{"name":"University of Minnesota,ECE Department,Minneapolis,MN,USA"}]},{"given":"Sachin S.","family":"Sapatnekar","sequence":"additional","affiliation":[{"name":"University of Minnesota,ECE Department,Minneapolis,MN,USA"}]},{"given":"Ramesh","family":"Harjani","sequence":"additional","affiliation":[{"name":"University of Minnesota,ECE Department,Minneapolis,MN,USA"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2018.8357060"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9474244"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2015.7223657"},{"key":"ref14","author":"croon","year":"2005","journal-title":"Matching Properties of Deep Sub-Micron MOS Transistors"},{"key":"ref11","first-page":"1","article-title":"Surface versus performance trade-offs: A review of layout techniques","volume":"1","author":"ferreira","year":"2022","journal-title":"Int J Circuits Syst"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/4.910469"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1989.572629"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1986.1052648"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2017.2771102"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.884403"},{"key":"ref7","first-page":"516","article-title":"Modeling within-die spatial correlation effects for process-design co-optimization","author":"friedberg","year":"2005","journal-title":"Proc ISQED"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICMTS.1996.535641"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICMTS.1994.303509"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.848021"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-90808-9"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/66.964318"}],"event":{"name":"ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)","location":"Lisbon, Portugal","start":{"date-parts":[[2023,9,11]]},"end":{"date-parts":[[2023,9,14]]}},"container-title":["ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10268496\/10268469\/10268572.pdf?arnumber=10268572","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,10,23]],"date-time":"2023-10-23T13:52:39Z","timestamp":1698069159000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10268572\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,11]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/essderc59256.2023.10268572","relation":{},"subject":[],"published":{"date-parts":[[2023,9,11]]}}}