{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,22]],"date-time":"2025-11-22T11:14:55Z","timestamp":1763810095850,"version":"3.44.0"},"reference-count":3,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,5,1]],"date-time":"2019-05-01T00:00:00Z","timestamp":1556668800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,5,1]],"date-time":"2019-05-01T00:00:00Z","timestamp":1556668800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,5]]},"DOI":"10.1109\/ets.2019.8791519","type":"proceedings-article","created":{"date-parts":[[2019,8,8]],"date-time":"2019-08-08T19:48:50Z","timestamp":1565293730000},"page":"1-2","source":"Crossref","is-referenced-by-count":6,"title":["A Dynamic Greedy Test Scheduler for Optimizing Probe Motion in In-Circuit Testers"],"prefix":"10.1109","author":[{"given":"L.","family":"Bonaria","sequence":"first","affiliation":[{"name":"SPEA Test Equipment"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Raganato","sequence":"additional","affiliation":[{"name":"SPEA Test Equipment"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M. Sonza","family":"Reorda","sequence":"additional","affiliation":[{"name":"Politecnico di Torino"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Squillero","sequence":"additional","affiliation":[{"name":"Politecnico di Torino"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref3","article-title":"A design method for minimum cost path of flying probe in-circuit testers","author":"hiratsuka","year":"2010","journal-title":"Proceedings of SICE Annual Conference"},{"key":"ref2","article-title":"Automatic Generation of In-Circuit Tests for Board Assembly Defects","author":"van schaaijk","year":"0","journal-title":"2018 IEEE International Test Conference in Asia (ITC-Asia)"},{"year":"0","key":"ref1"}],"event":{"name":"2019 IEEE European Test Symposium (ETS)","start":{"date-parts":[[2019,5,27]]},"location":"Baden-Baden, Germany","end":{"date-parts":[[2019,5,31]]}},"container-title":["2019 IEEE European Test Symposium (ETS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8784130\/8791505\/08791519.pdf?arnumber=8791519","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T18:19:32Z","timestamp":1755800372000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8791519\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,5]]},"references-count":3,"URL":"https:\/\/doi.org\/10.1109\/ets.2019.8791519","relation":{},"subject":[],"published":{"date-parts":[[2019,5]]}}}