{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T04:50:17Z","timestamp":1725598217980},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,5,23]],"date-time":"2022-05-23T00:00:00Z","timestamp":1653264000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,5,23]],"date-time":"2022-05-23T00:00:00Z","timestamp":1653264000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,5,23]]},"DOI":"10.1109\/ets54262.2022.9810415","type":"proceedings-article","created":{"date-parts":[[2022,7,1]],"date-time":"2022-07-01T15:37:54Z","timestamp":1656689874000},"page":"1-2","source":"Crossref","is-referenced-by-count":0,"title":["Prediction of Thermally Accelerated Aging Process at 28nm"],"prefix":"10.1109","author":[{"given":"Parvez Anwar","family":"Chanawala","sequence":"first","affiliation":[{"name":"University of British Columbia,Dept. of ECE,Vancouver,Canada"}]},{"given":"Ian","family":"Hill","sequence":"additional","affiliation":[{"name":"University of British Columbia,Dept. of ECE,Vancouver,Canada"}]},{"given":"S. Arash","family":"Sheikholeslam","sequence":"additional","affiliation":[{"name":"University of British Columbia,Dept. of ECE,Vancouver,Canada"}]},{"given":"Andre","family":"Ivanov","sequence":"additional","affiliation":[{"name":"University of British Columbia,Dept. of ECE,Vancouver,Canada"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2014.6818753"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2018.8353569"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-20051-0_4"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2008.915629"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2019.2961329"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.07.069"}],"event":{"name":"2022 IEEE European Test Symposium (ETS)","start":{"date-parts":[[2022,5,23]]},"location":"Barcelona, Spain","end":{"date-parts":[[2022,5,27]]}},"container-title":["2022 IEEE European Test Symposium (ETS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9810327\/9810358\/09810415.pdf?arnumber=9810415","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,25]],"date-time":"2022-07-25T16:16:17Z","timestamp":1658765777000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9810415\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,5,23]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/ets54262.2022.9810415","relation":{},"subject":[],"published":{"date-parts":[[2022,5,23]]}}}